2019
DOI: 10.1002/mmce.22106
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A low‐profile transmitarray antenna using square patch elements with cross dipole slots and vias

Abstract: A low‐profile transmitarray antenna comprising only a single‐layer substrate and operating at X‐band is presented in this paper. The element consists of two identical metallic layers placed on the upper and lower surfaces of a single‐layer substrate and four vias connecting two metal layers through the substrate. The thickness of the element is 3 mm, corresponding to only 0.1 λ at the design frequency. Metallic layers contain square patches etched with cross dipole slots. By varying the side length of the squa… Show more

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Cited by 5 publications
(3 citation statements)
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References 15 publications
(31 reference statements)
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“…By combining the advantages of the flat lens and phased array antenna, TA has the characteristics of a simple structure and low processing cost. Based on the traditional PCB technology, there are some relevant TA designs in various frequency bands [8][9][10][11][12][13][14][15][16][17][18]. Numerous applications of the traditional PCB technology TA design in communication are proposed.…”
Section: Introductionmentioning
confidence: 99%
“…By combining the advantages of the flat lens and phased array antenna, TA has the characteristics of a simple structure and low processing cost. Based on the traditional PCB technology, there are some relevant TA designs in various frequency bands [8][9][10][11][12][13][14][15][16][17][18]. Numerous applications of the traditional PCB technology TA design in communication are proposed.…”
Section: Introductionmentioning
confidence: 99%
“…In References 5–11, multi‐layer substrates including dielectric and metal have been used to achieve the full 360° phase correction coverage. In sources 5–11, multilayers including dielectric and metal are used to achieve a complete 360° phase correction coating.…”
Section: Introductionmentioning
confidence: 99%
“…In Reference 10, a low‐profile transmitarray antenna containing only a single‐layer substrate using square patch elements with cross dipole slots and vias at 10 GHz frequency is designed. The dimension of its unit cell is 0.5 λ 0 × 0.5 λ 0 .…”
Section: Introductionmentioning
confidence: 99%