Low profile LTCC balanced filter based on a lumped elements balun for WiMAX applications

Sakhnenko, S.; Orlenko, D.; Markov, K.; Yatsenko, Andriy; Vorotnikov, Borys; Sevskiy, G.; Heide, P.; Vossiek, Martin

doi:10.1109/mwsym.2008.4633251

Cited by 19 publications

(5 citation statements)

References 11 publications

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“…A balun is a passive component which converts unbalanced impedance to balanced and vice versa. Therefore, baluns are used in many wireless communication systems, and they have been reported already [8].…”

Section: Design Of Componentsmentioning

confidence: 99%

A novel single‐band RF front‐end module for wireless communication systems

Kim

et al. 2011

Micro & Optical Tech Letters

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In this article, a novel integrated RF front-end module (FEM) for wireless communication system is realized by low temperature co-fired ceramic (LTCC) technology. The proposed RF FEM has four ports and consists of a novel selectable filter, balun, which are fully embedded in the LTCC substrate, and two PIN diodes. This novel selectable filter can be applied for either lowpass filter (LPF) for Tx path or bandpass filter (BPF) for Rx path by simply making output port to be shorted to the ground. The fabricated single-band RF FEM has nine pattern layers including two ground layers and it occupies less than 2.3 Â 4.0 Â 0.44 mm 3 . In case of Tx path, the measured insertion loss at 2-GHz band is less than 2.3 dB and a return loss of more than 16.8 dB. Furthermore, it provide a more than 40.5 dB second harmonic suppression at 2-GHz is obtained. In case of Rx path, the measured insertion loss at 2-GHz band is less than 1.2 dB and a return loss of more than 16.7 dB. The measured results of the implemented RF FEM are in good agreement with the simulated results.

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Section: Design Of Componentsmentioning

confidence: 99%

A novel single‐band RF front‐end module for wireless communication systems

Kim

et al. 2011

Micro & Optical Tech Letters

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“…Some works based on lumped elements have been developed to achieve the compactness using the low-temperature co-fired ceramic technology [6][7][8]. More works about balanced filters are designed with distributed elements of transmission-line structures, such as one-layered microstrip line [9][10][11][12][13][14][15], multi-layer stripline [16], double-sided parallel-strip line [17,18] and hybrid microstrip/slotline [19][20][21][22][23].…”

Section: Introductionmentioning

confidence: 99%

Balanced substrate integrated waveguide bandpass filter with high selectivity and common‐mode suppression

Chu

Chen

2015

IET Microwaves, Antennas & Propagation

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A new method of designing balanced (differential) bandpass filters (BPFs) with high selectivity and common-mode suppression is proposed and implemented by taking advantage of the existence of multiple substrate integrated waveguide cavity modes. The major design concept is by properly choosing, feeding and coupling dual-mode cavities operating at TE 102 and TE 201 modes so as to not only provide capabilities to realise the desired differential-mode passband associated with two transmission zeros, but also generate high common-mode suppression over a wide range. Two X-band BPFs with different internal coupling mechanisms are then proposed and designed. The two design examples having the same centre frequency of 10 Hz and respective passband width of 300 and 270 Hz are fabricated for demonstration. High selectivity is observed for both filters. Meanwhile, c is ∼37 dB for the first design example, whereas it is improved to 48.5 dB for the second one with multi-layered structure. Good agreement can be observed between simulated and measured performances in the authors' study.

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“…To achieve this function, a variety of BPF design efforts can be found in the literature. A popular design approach is embedding BPF in low temperature co‐fired ceramic (LTCC) such as the interdigital BPF using distributed components or a balanced filter design in a low‐profile LTCC using lumped elements. Multilayer organic substrate has been used for embedded passives .…”

Section: Introductionmentioning

confidence: 99%

Development of 5.5‐GHz Band Pass Filter in All Silicon Multilayer Substrate with Air Dielectric

Cho

Franklin

2013

Micro & Optical Tech Letters

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A compact 5.5‐GHz band pass filter (BPF) with 12.7% 3‐dB bandwidth is developed in an all silicon multilayer substrate with air dielectric incorporated for WiMax applications. The topology of the BPF is a capacitively coupled fifth‐order Chebyshev BPF. Its volume is 9.3 × 8.5 × 0.6 mm3. Two design aspects—air dielectric and through silicon via (TSV) technology integration—play an essential role in the BPF implementation. The spiral inductor with an integrated air dielectric has quality factor and self‐resonant frequency improvement of 112 and 41%, respectively. The TSVs in the BPF design enables the implementation of two‐layer inductors with a low value of inductance. The volume of TSV in the two‐layer inductor is 75 × 75 × 200 μm3 and its inductance is 0.15 nH at 5 GHz. © 2013 Wiley Periodicals, Inc. Microwave Opt Technol Lett 55:2340–2345, 2013

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Low profile LTCC balanced filter based on a lumped elements balun for WiMAX applications

Cited by 19 publications

References 11 publications

A novel single‐band RF front‐end module for wireless communication systems

A novel single‐band RF front‐end module for wireless communication systems

Balanced substrate integrated waveguide bandpass filter with high selectivity and common‐mode suppression

Development of 5.5‐GHz Band Pass Filter in All Silicon Multilayer Substrate with Air Dielectric

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