2009 IEEE MTT-S International Microwave Symposium Digest 2009
DOI: 10.1109/mwsym.2009.5165791
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Low phase noise 77 GHz VCO with optimized terminated impedance at fundamental and second harmonic frequencies

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Cited by 3 publications
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“…To decrease the assembly cost, each MMIC such as the oscillator and the amplifier should be integrated to a single chip. In the reported GaAs-MMICs, the HBT process, which can suppress 1/f noise, is employed for oscillators whereas the HEMT process is used for amplifiers and multipliers because of the high gain characteristics at the millimeter wave band [1][2][3][4][5][6]. As just described, an RF front-end consists of some MMICs because of different processes.…”
Section: Introductionmentioning
confidence: 99%
“…To decrease the assembly cost, each MMIC such as the oscillator and the amplifier should be integrated to a single chip. In the reported GaAs-MMICs, the HBT process, which can suppress 1/f noise, is employed for oscillators whereas the HEMT process is used for amplifiers and multipliers because of the high gain characteristics at the millimeter wave band [1][2][3][4][5][6]. As just described, an RF front-end consists of some MMICs because of different processes.…”
Section: Introductionmentioning
confidence: 99%