Low-insertion-loss compact 3D-MEMS optical matrix switch with is input/output ports

Kazama, Atsushi; Itou, Yasuhiro; Horino, Masaya; Fukuda, Kazuyuki; Kanamaru, Masatoshi; Akashi, T.; Ishikawa, Tadaaki; Harada, Taishi; Okada, Ryoji

doi:10.1109/sensor.2005.1496617

Cited by 3 publications

(7 citation statements)

References 5 publications

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“…Currently, optical MEMS switch modules are assembled through die level flip-chip bonding with either epoxies or solder bumps. To assemble such a multi-chip stack module, the components are fabricated independently at the wafer level, diced, and then assembled though flip-chip bonding [2][3][4][5] . The obvious advantages of this assembly approach are to reduce the complexity of manufacturing of each component and optimize the individual fabrication processes to achieve good wafer yield, as well as being able to match die defects to allow the maximum yield.…”

Section: Motivationmentioning

confidence: 99%

“…MEMS optical switch systems based on beam steering mirrors have been explored by many researchers [1][2][3][4][5] . These switches allow many optical channels to be switched in a relatively small amount of space, utilizing micromirrors to switch or reflect an optical signal from one fiber to another dependent on the relative angle of the micromirror, as shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

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Cost-effective method of manufacturing a 3D MEMS optical switch

Carr¹,

Zhang²,

Keebaugh³

et al. 2009

SPIE Proceedings

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The demand for micro-electro-mechanical system (MEMS) optical switches has been steadily increased due to the rapid growth of data and video transport networks. All-optical switching eliminates the need for optical-electrical conversion offering the ability to switch optical signals transparently: independent of data rates, formats and wavelength. It also provides network operators much needed automation capabilities to create, monitor and protect optical light paths. To further accelerate the market penetration, it is necessary to identify a path to reduce the manufacturing cost significantly as well as enhance the overall system performance, uniformity and reliability. Currently, most MEMS optical switches are assembled through die level flip-chip bonding with either epoxies or solder bumps. This is due to the alignment accuracy requirements of the switch assembly, defect matching of individual die, and cost of the individual components. In this paper, a wafer level assembly approach is reported based on silicon fusion bonding which aims to reduce the packaging time, defect count and cost through volume production. This approach is successfully demonstrated by the integration of two 6-inch wafers: a mirror array wafer and a "snap-guard" wafer, which provides a mechanical structure on top of the micromirror to prevent electrostatic snap-down. The direct silicon-to-silicon bond eliminates the CTEmismatch and stress issues caused by non-silicon bonding agents. Results from a completed integrated switch assembly will be presented, which demonstrates the reliability and uniformity of some key parameters of this MEMS optical switch.

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Section: Motivationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Cost-effective method of manufacturing a 3D MEMS optical switch

Carr¹,

Zhang²,

Keebaugh³

et al. 2009

SPIE Proceedings

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show abstract

“…Figure 1 illustrates the three-dimensional structure of an OBSA consisting of two mirror arrays and one collimatorlens array [5], and its cross-sectional image is shown in figure 2. The mirror arrays are stacked on the collimatorlens array.…”

Section: Structure Of An Obsamentioning

confidence: 99%

“…All mirrors on the first and second mirror substrates are individually suspended by two torsion beams. The shape of the mirrors with the folded torsion beams was designed on the basis of the previous consideration [5]. As shown in figure 2, the mirrors on the first mirror substrate rotate around the y-axis; the mirrors on the second mirror substrate rotate around the x-axis.…”

Section: Structure Of An Obsamentioning

confidence: 99%

Fabrication of an optical beam scanning array integrating mirror and lens arrays by passive self-alignment using precisely formed through-holes

Akashi¹,

Kanamaru²,

Kazama³

et al. 2005

J. Micromech. Microeng.

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An optical beam scanning array (OBSA) integrating two mirror arrays and a collimator-lens array was fabricated. The passive self-alignment inserting a pin into a through-hole was carried out for integration of the mirror arrays and the collimator-lens array. The mirror arrays consist of a mirror substrate with 35 single-axis-rotational mirrors and an electrode substrate for actuating the corresponding mirror by electrostatic force. Each substrate includes two kinds of through-holes: one for passing a collimated-optical beam through, the other for inserting a pin. The conditions for deep-reactive-ion etching (DRIE) of silicon were optimized to form through-holes suitable for passive self-alignment. DRIE from both surfaces of a silicon wafer under the optimized DRIE conditions—a C4F8/SF6 gas-flow ratio of 90% and a bias power in SF6 gas of 110 W—formed precision through-holes with an average undercut of 3.4 µm and an average sidewall angle of 89.9°. The passive self-alignment then yielded an assembly deviation of less than 17.5 µm, which meets the specification of less than 50 µm. This means that passive self-alignment using a through-hole formed under the optimized DRIE conditions can be exploited to make OBSAs without requiring optical alignment of mirrors and lenses.

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“…In practice, however, the process is accelerated by one-or two-axis optical steering by means of a polygonal mirror or galvanometer mirror; in addition, MEMS mirrors, with the advantages of compact size and low power consumption, are also employed. MEMS mirrors can be designed as multimirrors (mirror arrays) for projectors and optical cross-connects [3,4], or as single mirrors for projection and precise measurement by portable terminals. In the case of single mirrors, the drive schemes can be divided into piezoelectric, electrostatic, and electromagnetic.…”

Section: Introductionmentioning

confidence: 99%

Electromagnetically driven two‐axis optical beam steering MEMS mirror and its dependence of actuation on magnetic field

Watanabe

Abe

Iwamatsu

et al. 2011

Elect Comm in Japan

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SUMMARYThis paper describes the development of an electromagnetically driven two-axis MEMS mirror which steers an optical beam, and the dependence of the tilting angles on the magnet shape and size and the initial gap between planar coils and the magnet surface. A reflective Au mirror (1.8 × 1.8 mm 2 ) can be tilted bidirectionally with an electromagnetic force induced by the current of the planar coils and the magnetic field of a permanent magnet. A newly developed MEMS mirror device (10 × 10 × 0.2 mm 3 ) was set on a printed circuit board (15 × 15 × 1.0 mm 3 ), and the board was fixed on a holder in which a magnet was inset. The utilized magnets were cubic (6, 8, and 15 mm square and 5 mm thick), cylindrical (6 and 8 mm in diameter and 5 mm thick), and spherical (8 mm in diameter) to investigate efficient actuation. The initial gaps of the planar coils and magnet surface were 0, 500, 1000, and 2000 µm. The magnetic flux density and its gradient decreased with distance from the magnet surface. The tilting angles of the MEMS mirror increased with decreasing size of the square magnet and shorter distance, and were largest when using a magnet 6 mm square and a 500-µm gap, in which condition the maximum tilting angles in the X and Y directions were 2.95 and 3.68 deg/mA, respectively. In addition, we obtained 3D-OCT images of human finger tissue by using a Fourier domain fiber interferometer with a newly developed MEMS mirror.

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Low-insertion-loss compact 3D-MEMS optical matrix switch with is input/output ports

Cited by 3 publications

References 5 publications

Cost-effective method of manufacturing a 3D MEMS optical switch

Cost-effective method of manufacturing a 3D MEMS optical switch

Fabrication of an optical beam scanning array integrating mirror and lens arrays by passive self-alignment using precisely formed through-holes

Electromagnetically driven two‐axis optical beam steering MEMS mirror and its dependence of actuation on magnetic field

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