Low <i>k</i> epoxy resin containing cycloaliphatic hydrocarbon with high crosslinking density

Kong, Lingqiang; Cheng, Yuanrong; Jin, Yunxia; Qi, Tianke; Xiao, Fei

doi:10.1002/app.43456

Cited by 31 publications

(26 citation statements)

References 40 publications

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“…As can be seen from Table 1, c-FSi-BCB sheets exhibit the average D k of 2.60 with the average D f of 1.49 × 10 −3 . These results are much lower than those of the commercial low-k materials and previously reported low-k materials, such as epoxy resins (2.8-3.5), [6,24,25] polyimides (2.8-3.5), [26,27] and BCB-based resins (2.8-2.9). [28,29] Surprisingly, such good dielectric properties are still kept even after immersing c-FSi-BCB in boiling water for 96 h (see Table 1).…”

Section: Dielectric Properties and Hydrophobicity Of C-fsi-bcbcontrasting

confidence: 62%

A Fluorinated Thermocrosslinkable Organosiloxane: A New Low‐k Material at High Frequency with Low Water Uptake

Liu

Chen

Hou

et al. 2020

Macromol. Rapid Commun.

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In order to obtain low‐k material with good comprehensive properties, a trifluoromethyl‐containing organosiloxane with thermocrosslinkable vinyl and benzocyclobutene groups is designed and synthesized through the Piers–Rubinsztajn reaction. After treating at high temperature, the organosiloxane changed to form a cross‐linked polysiloxane (called as c‐FSi‐BCB). c‐FSi‐BCB exhibits good dielectric properties with dielectric constant (Dk) of 2.60 and dielectric loss (Df) of 1.49 × 10−3 at a high frequency of 5 GHz. Importantly, c‐FSi‐BCB maintains such good dielectric properties and exhibits low water uptake of below 0.076%, even after immersing it in boiling water for 96 h. c‐FSi‐BCB also displays good thermostability with a 5% weight loss temperature (T5d) of 453 °C. These data indicate that this fluorinated organosiloxane is suitable as the matrix resin for the fabrication of devices used in 5G communication.

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Section: Dielectric Properties and Hydrophobicity Of C-fsi-bcbcontrasting

confidence: 62%

A Fluorinated Thermocrosslinkable Organosiloxane: A New Low‐k Material at High Frequency with Low Water Uptake

Liu

Chen

Hou

et al. 2020

Macromol. Rapid Commun.

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“…Contrastingly, there is a method to restrict the mobility of the epoxy network chains by introducing a rigid framework . Until now, we have also focused on mesogenic epoxy resins, which have higher thermal and mechanical properties than conventional epoxy resins .…”

Section: Introductionmentioning

confidence: 99%

Thermal and mechanical properties of tetra‐functional mesogenic type epoxy resin cured with aromatic amine

Harada

Morioka

Ochi

2017

J of Applied Polymer Sci

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A novel tetra-functional epoxy monomer with mesogenic groups was synthesized and characterized by 1 H-NMR and FTIR. The synthesized epoxy monomer was cured with aromatic amine to improve the thermal property of epoxy/amine cured system. The glass transition temperature (T g ) and coefficient of thermal expansion (CTE) of the cured system were investigated by dynamic mechanical analysis and thermal mechanical analysis. The properties of the cured system were compared with the conventional bisphenol-A type epoxy and mesogenic type epoxy system. The storage modulus of the tetra-functional mesogenic epoxy cured systems showed the value of 0.96 GPa at 250 8C, and T g -less behavior was clearly observed. The cured system also showed a low CTE at temperatures above 150 8C without incorporation of inorganic components. These phenomena were achieved by suppression of the thermal motion of network chains by introduction of both mesogenic groups and branched structure to increase the cross linking density. The temperature dependency of the tensile property and thermal conductivity of the cured system was also investigated.

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“…21,22 Furthermore, the existence of uorinate and stiff non-polar structure can also decrease moisture absorption and improve the thermal stability of materials. 23 Sasaki 24 reported that the bisphenol A type epoxy resin cured with uorinated phthalic anhydride had the lowest dielectric constant (2.77) and dielectric loss factor (0.01) among all cured epoxy resins.…”

Section: -9mentioning

confidence: 99%

Preparation and characterization of novel naphthyl epoxy resin containing 4-fluorobenzoyl side chains for low-k dielectrics application

Jiang

Zhao

et al. 2017

RSC Adv.

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A new type of epoxy monomer 1,5-bis(4-fluorobenzoyl)-2,6-diglycidyl ether naphthalene (DGENF) was obtained through a three-step procedure involving Friedel-Crafts acylation, demethylation, and followed by nucleophilic reaction. The chemical structures were confirmed by 1 HNMR, 19 FNMR and FT-IR. After curing with methylhexahydrophthalic anhydride (MeHHPA), the properties of DGENF epoxy resin were measured and compared with three other kinds of commercial epoxy resins. As a result, DGENF exhibited excellent thermal stability, hydrophobic and dielectric properties. For example, DGENF had a higher glass transition temperature of 170 C than the other three commercial epoxy resins. DGENF showed a higher contact angle of 116 , which could satisfy the standard of hydrophobic materials. In addition, DGENF showed significantly lower dielectric constant (2.97 at 1 MHz) and dielectric loss (0.0188 at 1 MHz) than those of the other commercial epoxy resins because of the introduction of fluorine on the side chains, which improved the electronegativity of the epoxy resin and reduced the polarizability of molecules efficiently. Herein, we believe the novel naphthyl epoxy resin (DGENF) has demonstrated potential application in electronic industries.

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Low k epoxy resin containing cycloaliphatic hydrocarbon with high crosslinking density

Cited by 31 publications

References 40 publications

A Fluorinated Thermocrosslinkable Organosiloxane: A New Low‐k Material at High Frequency with Low Water Uptake

A Fluorinated Thermocrosslinkable Organosiloxane: A New Low‐k Material at High Frequency with Low Water Uptake

Thermal and mechanical properties of tetra‐functional mesogenic type epoxy resin cured with aromatic amine

Preparation and characterization of novel naphthyl epoxy resin containing 4-fluorobenzoyl side chains for low-k dielectrics application

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