2005
DOI: 10.1016/j.sse.2005.03.009
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Low-frequency noise and Coulomb scattering in Si0.8Ge0.2 surface channel pMOSFETs with ALD Al2O3 gate dielectrics

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Cited by 23 publications
(24 citation statements)
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“…Also, the spread is significantly higher compared with the interface traps. The scattering coefficient derived from the initial slope of the 1/µ versus qD ot trend yields an acceptable value in the range of 10 4 V · s/C [21], [22], [24].…”
Section: Resultsmentioning
confidence: 94%
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“…Also, the spread is significantly higher compared with the interface traps. The scattering coefficient derived from the initial slope of the 1/µ versus qD ot trend yields an acceptable value in the range of 10 4 V · s/C [21], [22], [24].…”
Section: Resultsmentioning
confidence: 94%
“…It should be noted that for the 1/f noise of metal gate/high-κ p-channel transistors, one usually finds a behavior that is more in line with the mobility fluctuations (∆µ) theory [15], [20], although it has been shown that on Si 0.8 Ge 0.2 surface channel pMOSFETs with ALD Al 2 O 3 /TiN stack correlated number fluctuations appear to be dominant [21].…”
Section: Resultsmentioning
confidence: 99%
“…As is well known, the mobility is limited by ionized impurity scattering, surface roughness scattering and phonon (lattice) scattering, and Coulomb scattering of free carriers at trapped charges in the oxide [27], [28], which can be given by…”
Section: Discussionmentioning
confidence: 99%
“…151 A forming gas anneal, 10% H 2 /90% N 2 at 400 °C, was employed in all high-k devices in this work and is not given particular attention here. Instead, in order to reduce the fixed charge and trap densities in the high-k material (even further), thereby possibly reducing the 1/f noise, a novel post-processing step in form of low-temperature water vapour annealing was performed.…”
Section: Influence Of Different Annealing Treatmentsmentioning
confidence: 99%