2006
DOI: 10.1016/j.mee.2006.01.099
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Low energy electron beam microcolumn lithography

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Cited by 13 publications
(4 citation statements)
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“…In this concept, the beamlets are separated everywhere in the machine in order to prevent Coulomb interactions. In some systems, every beamlet has its own full electron optics with electron source, lenses, alignment coils, stigmators, etc., [22][23][24][25][26][27], so each column is a small SEM or Gaussian electron beam machine. The lenses and deflector units are made using MEMS technology, as shown in Fig.…”
Section: Discussion Of Systems Using Memsmentioning
confidence: 99%
“…In this concept, the beamlets are separated everywhere in the machine in order to prevent Coulomb interactions. In some systems, every beamlet has its own full electron optics with electron source, lenses, alignment coils, stigmators, etc., [22][23][24][25][26][27], so each column is a small SEM or Gaussian electron beam machine. The lenses and deflector units are made using MEMS technology, as shown in Fig.…”
Section: Discussion Of Systems Using Memsmentioning
confidence: 99%
“…Electron beam (E-beam) lithography is a technique for forming a photoresist (PR) pattern on a sample surface by bonding or cutting off polymers constituting a PR by irradiating high-energy electrons onto the surface of a sample coated with an E-beam reactive PR. Beginning from the scanning electron microscopy (SEM) technology in the 1950s [1], the E-beam lithography technique has been consistently developed towards the fabrication of smaller features with higher resolutions, based on tactful beam source deployment, use of an ultrafine-precision staging and optical system, and resist enhancement [1][2][3][4][5][6][7]. Careful tuning has also been investigated for application to various other materials, such as biological cells and soft polymers [8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…Seams can be reduced to a very small extent by controlling the molding material and exposure conditions [49], which can be applied to large area displays, but some applications still require perfect seamless nanopatterns throughout the entire area. Many other methods have been presented to fabricate the roll-type master stamps [5][6][7][48][49][50], but these mostly suffer from similar issues, particularly regarding the translation from the flat plate to the cylindrical surface.…”
Section: Introductionmentioning
confidence: 99%
“…Owing to the high fabrication cost and long production time for photomasks, the multi photomask lithography processes are driving the development of lithography without conventional photomasks. 1) There were reports about maskless photography methods such as the use of the digital mirror device (DMD), [2][3][4][5][6][7][8] laser direct imaging (LDI), [9][10][11][12][13][14] electron beam lithography (EBL), [15][16][17][18][19][20][21] ion beam lithography (IBL), [22][23][24] and the use of the liquid crystal mask (LCM). [25][26][27] LCM photolithography technology can shorten the develop time and reduce the production cost of PCBs compared with the conventional photolithography technology.…”
Section: Introductionmentioning
confidence: 99%