Low dielectric constant Parylene-F-like films for intermetal dielectric applications

Abstract

Cataloged from PDF version of article.We report on the dielectric properties and thermal stability of thin polymer films that art: suitable candidates for replacing silicon dioxide as the intermetal dielectric material in integrated circuits. Parylene-F-Iike films, (-CF2-C6H4-CF2-)(n), were produced by plasma deposition from a mixture of Ar and 1,4-bis(trifluoromethyl)benzene (CF3-C6H4-CF3) discharges and characterized using infrared absorption spectroscopy, spectroscopic ellipsometry, and capacitance measurements. The dielectric constant and the magnitude of the electronic and ionic contributions to the dielectric constant were determined through capacitance measurements and Kramers-Kronig analysis of the infrared absorption data. The film's dielectric constant ranges between 2 and 2.6 depending on the deposition conditions and the largest contribution to the dielectric constant is electronic. The films deposited at 300 degrees C are stable above 400 degrees C and further optimization could push this limit to as high as 500 degrees C. (C) 1999 American Institute of Physics

A molecular dynamics study on permeability of gases through parylene AF8 membranes

“…The electrons of amorphous parylene AF8 membranes have enough activity to absorb gases that increase the total van der Waals and electrostatic terms. The corresponding F–F atomic distances are less in amorphous AF8 membranes . As seen in Fig.…”

“…The corresponding F-F atomic distances are less in amorphous AF8 membranes. [2] As seen in Fig. 8, gases exist and move near the polymers molecules in the free volumes of parylene AF8 membranes.…”

“…Its chemical formula is [C 8 F 8 ] n . Parylene AF8 membranes used as gas barrier coating materials have been studied and applied in the present work, such as gas barrier films of CHNO energetic materials . Therein, the permeation properties of gases were influenced by the related solubility and diffusion coefficients.…”

“…[1] Parylene AF8 membranes used as gas barrier coating materials have been studied and applied in the present work, such as gas barrier films of CHNO energetic materials. [2] Therein, the permeation properties of gases were influenced by the related solubility and diffusion coefficients. To obtain the accuracy permeability, the researchers have a growing interest in studying diffusion properties of gases through parylene membranes from a molecular point of view.…”

Correlation of Growth and Surface Properties of Poly(\(p\)-xylylenes) to Reaction Conditions

“…For the polymerization of p-xylylene, with its commercial name parylene, which is widely used as a coating material for medical purposes [10,11], but also for isolating purposes with a pinhole-free film that is impermeable to water vapor and other gases, even at very low thicknesses [12,13], several reactions have to be investigated: "conventional" chemical vapor deposition happens by expanding at least one reactive gas in a vacuum reactor, which is either subjected to thermolysis or to a second gas, resulting in a chemical reaction. In contrast to these processes, parylene is mostly deposited by the Gorham process, which requires evaporation of a precursor, and temperatures between 130 and 150…”