Low-coverage sulfur induced reconstruction of Ni(111)

Maurice, Vincent; Kitakatsu, N.; Siegers, M.; Marcus, Philippe

doi:10.1016/s0039-6028(96)01182-x

Cited by 33 publications

(17 citation statements)

References 27 publications

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“…STM studies of sulfur adsorbed on Ni(1 1 1) by Maurice et al [34] find that above 625 K sulfur will migrate to the steps, where sulfur islands will nucleate. This is in full agreement with our calculations, which predict sulfur to be 35 kJ/mol more stable on Ni(2 1 1) than on Ni (1 1 1).…”

Section: Discussionmentioning

confidence: 99%

Methane activation on Ni(111): Effects of poisons and step defects

Abild‐Pedersen¹,

Lytken²,

Engbæk³

et al. 2005

Surface Science

232

170

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Section: Discussionmentioning

confidence: 99%

Methane activation on Ni(111): Effects of poisons and step defects

Abild‐Pedersen¹,

Lytken²,

Engbæk³

et al. 2005

Surface Science

232

170

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“…56 Data indicate a sulfur -induced reconstruction of the Ni(111) surface, resulting in the formation of chemisorption sites having a fourfold symmetry that is characteristic of the (100) fcc system. This mismatch between the sulfur unit cell and the threefold symmetry of the underlying Ni(111) unit cell is hypothesized to lead to weakening of the Ni-Ni bonds, hence favoring anodic dissolution.…”

Section: 3mentioning

confidence: 98%

Adsorbate‐catalyzed anodic dissolution and oxidation at surfaces in aqueous solutions

Kelber

Seshadri

2001

Surface & Interface Analysis

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Certain adsorbates, particularly sulfur and iodine, present at submonolayer coverages catalyze anodic dissolution or oxidation at selected transition metal surfaces. No change in adsorbate surface coverage or oxidation state is observed during the dissolution process, indicating that the process is truly catalyzed by the adsorbed impurity. This allows enhanced dissolution to take place in environments entirely free of solvated forms of the impurity. In the case of iodine, the mechanism depends in part on the relative strength of iodine-metal vs. metal-metal bond strengths, but also depends on other factors that are as yet poorly understood. In the case of adsorbed sulfur, the effect is related to the ability of adsorbed sulfur to hinder the formation of an oxide layer via the complete dissociation of water at the solid surface. The relevance of these adsorbate-catalyzed processes to intergranular stress corrosion cracking and semiconductor device processing are discussed.

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“…STM 63 revealed that sulfur induced the Ni(111) surface reconstruction to form chemisorption sites having a 4-fold symmetry (characteristic of the (100) face in the fcc system). This chemisorption weakens the Ni-Ni bonds and favors dissolution of the metal surface, as the passage of metal atoms from the surface to the aqueous solution involves the breaking of metal-metal bonds.…”

Section: ••mentioning

confidence: 99%

pH Effect on Sulfur-Induced Passivity Degradation of Alloy 800 in Simulated Crevice Chemistries

Xia

Zhu

Behnamian

et al. 2014

J. Electrochem. Soc.

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The effects of pH on sulfur-induced passivity degradation of Alloy 800 in simulated crevice chemistries were evaluated using electrochemical impedance spectroscopy (EIS), secondary ion mass spectroscopy (SIMS), and Mott-Schottky analysis methods. Experimental results reveal that the detrimental effect of impurities containing sulfur at the reduced or intermediate oxidation level (S x ) on the passivity of Alloy 800 depends significantly on the solution pH. In neutral crevice (NC) chemistry containing chloride ions, the S x obstructs the healing process during repassivation, retards the dehydration reaction and also incorporates H, -OH and S into the passive film. However, the detrimental effect of S x is insignificant in an alkaline crevice (AKC) solution due to a change in surface adsorption and surface charge. Impurities containing sulfur at the reduced or intermediate oxidation level would cause Alloy 800 to lose its passivity and become active in an acidic crevice (AC) chemistry. Experimental evidence also indicates that the solution pH alters the semiconductor type of the surface film -from n-type in NC solution to p-type in AKC solution.

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Low-coverage sulfur induced reconstruction of Ni(111)

Cited by 33 publications

References 27 publications

Methane activation on Ni(111): Effects of poisons and step defects

Methane activation on Ni(111): Effects of poisons and step defects

Adsorbate‐catalyzed anodic dissolution and oxidation at surfaces in aqueous solutions

pH Effect on Sulfur-Induced Passivity Degradation of Alloy 800 in Simulated Crevice Chemistries

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