2006
DOI: 10.1016/j.solmat.2006.03.020
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Low cost surface passivation for p-type mc-Si based on pseudobinary alloys (Al2O3)x(TiO2)1−x

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Cited by 18 publications
(8 citation statements)
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“…136 The search for a suitable dielectric to passivate p-type silicon surfaces has been increasingly intensive since the early 2000s. 37,[137][138][139][140][141] A breakthrough came with the advent of aluminum oxide, which is a negative fixed-charge dielectric, 39,40 essentially avoiding the shunting path caused by silicon nitride in locally contacted solar cells. Such films show a very high negative fixed-charge density (around 10 13 cm À2 ), 27 strongly attracting holes to the surface and thus creating a p + accumulation layer, which helps to suppress electron recombination at the rear surface.…”
Section: Review Energy and Environmental Sciencementioning
confidence: 99%
“…136 The search for a suitable dielectric to passivate p-type silicon surfaces has been increasingly intensive since the early 2000s. 37,[137][138][139][140][141] A breakthrough came with the advent of aluminum oxide, which is a negative fixed-charge dielectric, 39,40 essentially avoiding the shunting path caused by silicon nitride in locally contacted solar cells. Such films show a very high negative fixed-charge density (around 10 13 cm À2 ), 27 strongly attracting holes to the surface and thus creating a p + accumulation layer, which helps to suppress electron recombination at the rear surface.…”
Section: Review Energy and Environmental Sciencementioning
confidence: 99%
“…It is desirable because it is deposited at temperatures below 200 1C [22,23]. Thus a passivation study of the cells was performed using atomic layer deposited (ALD) alumina in a custom designed viscous flow reactor.…”
Section: Experimental Optimization Of Cell Passivationmentioning
confidence: 99%
“…Many technologies can be employed to grow TiO 2 thin films, such as PECVD, APCVD, PLD, spray pyrolysis, reactive sputtering, and sol-gel [13]. In this paper, we grew TiO 2 thin films on Si wafers by atomic layer deposition (ALD) which performs excellent uniformity, accurate thickness control, and almost 100% step coverage on substrate surface [14].…”
Section: Introductionmentioning
confidence: 99%