1997
DOI: 10.1109/96.618225
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Low-cost fabrication of optical subassemblies

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Cited by 15 publications
(5 citation statements)
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“…До 2000 года основным методом фиксации элементов модулей была фиксация при помощи клеев на основе эпоксидных смол [4] (рис.3a). Несмотря на то, что работать с эпоксидными клеями достаточно удобно, после сборки модуля необходимо проводить термоциклирование и ускоренные испытания.…”
Section: фиксация элементов лазерного диодного модуляunclassified
“…До 2000 года основным методом фиксации элементов модулей была фиксация при помощи клеев на основе эпоксидных смол [4] (рис.3a). Несмотря на то, что работать с эпоксидными клеями достаточно удобно, после сборки модуля необходимо проводить термоциклирование и ускоренные испытания.…”
Section: фиксация элементов лазерного диодного модуляunclassified
“…Practically, short-reach optical interconnects have played a crucial role in such applications as data processing units, multimedia consumer electronics, optical storage systems, etc [3][4][5]. Transmitter (Tx) and receiver (Rx) modules, requiring a low cost and a large volume production capability, are particularly suitable to the adoption of optical interconnects [4][5][6][7][8]. Toward this end, an optical sub-assembly (OSA) using vertical cavity surface emitting lasers (VCSELs) has been extensively studied [4,[8][9][10][11][12], in conjunction with plastic optical fibers (POFs) allowing for an easy handling [4,5,12].…”
Section: Introductionmentioning
confidence: 99%
“…Toward this end, an optical sub-assembly (OSA) using vertical cavity surface emitting lasers (VCSELs) has been extensively studied [4,[8][9][10][11][12], in conjunction with plastic optical fibers (POFs) allowing for an easy handling [4,5,12]. For implementing those Tx/Rx modules, a plastic injection molding [4,6] and a passive assembly [4,[8][9][10] have been also actively researched in view of a low-cost volume production. Previously there have been reports on multi-channel modules using step-index POFs with a bit rate of 1.6 Gbps per channel [13], yet they did not accomplish a fully passive alignment based on a pick-and-place scheme.…”
Section: Introductionmentioning
confidence: 99%
“…Optical interconnects have started to become a viable alternative to conventional copper based cables, which pose several critical issues in terms of bandwidth, electromagnetic interference, thermal management, and weight [1,2]. The availability of low-cost optical subassembly modules (OSAs) is essential to accelerating the penetration of optical interconnects into the market [3][4][5][6]. Such modules can be achieved by primarily reducing the cost of light sources and connecting fibers, and by facilitating the assembly procedures [7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%