An ultra-small integrated photonic temperature sensor has been proposed and demonstrated which incorporates a silicon ring resonator linked to a vertical grating coupler. It was manufactured using a 0.18 μm standard CMOS process, rendering a homogeneous integration into other electrical/optical devices. The temperature variation was measured by monitoring the shift in the resonant wavelength of the silicon resonator, which was induced by the thermo-optic effect and the thermal expansion effect. The dependence of its sensing capability upon the waveguide width of the resonator was intensively probed both theoretically and experimentally. The best achieved sensitivity was about 83 pm/°C for a waveguide width of 500 nm, while the sensitivity was boosted by ~10 pm/°C by adjusting the waveguide width from 300 nm to 500 nm. Finally, the response speed of the sensor was as fast as ~6 μs.

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A refractometric sensor resorting to a vertically coupled polymeric microdisk resonator was demonstrated, estimating the refractive index (RI) of an analyte by monitoring the resonant wavelength shift in its transfer characteristics. The disk resonator was especially overlaid with a high RI TiO2 film, thereby reinforcing the interaction of the evanescent field of its guided mode with the analyte. The sensitivity of the sensor was theoretically and experimentally confirmed to be enhanced by adjusting the overlay thickness. The fabricated sensor provided the maximum sensitivity of approximately 294 nm/RIU (refractive index unit) with the 40-nm-thick overlay, which is equivalent to an improvement of 150% compared with the case without the overlay.

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Ribbon plastic optical fiber (POF) linked four-channel optical transmitter (Tx) and receiver (Rx) modules have been proposed and realized featuring an excellent alignment tolerance. The two modules share a common configuration involving an optical sub-assembly (OSA) with vertical cavity surface emitting lasers (VCSELs)/photodetectors (PDs), and their driver ICs, which are integrated onto a single printed circuit board (PCB) substrate. The OSA includes an alignment structure, a beam router and a fiber guide, which were produced by using plastic injection molding. We have accomplished a fully passive alignment between the VCSELs/PDs and the ribbon POF by taking advantage of the alignment structure that serves as a reference during the alignment of the constituent parts of the OSA. The electrical link, which largely determines the operation speed, has been remarkably shortened, due to a direct wire-bonding between the VCSELs/PDs and the driver circuits. The light sources and the detectors can be individually positioned, thereby overcoming the pitch limitations of the ribbon POF, which is made up of perfluorinated graded-index (GI) POF with a 62.5 μm core diameter. The overall alignment tolerance was first assessed by observing the optical coupling efficiency in terms of VCSEL/PD misalignment. The horizontal and vertical 3-dB alignment tolerances were about 20 μm and 150 μm for the Tx and 50 μm and over 200 μm for the Rx, respectively. The VCSEL-to-POF coupling loss for the Tx and the POF-to-PD loss for the Rx were 3.25 dB and 1.35 dB at a wavelength of 850 nm, respectively. Subsequently, a high-speed signal at 3.2 Gb/s was satisfactorily delivered via the Tx and Rx modules over a temperature range of -30 to 70°C with no significant errors; the channel crosstalk was below -30 dB. Finally, the performance of the prepared modules was verified by transmitting a 1080p HDMI video supplied by a Bluelay player to an LCD TV.