Low-Cost and Disposable Electrowetting-on-Dielectric Lab on a Chip With an Integrated Electrochemical Detector Fabricated by Screen-Printing Process

Ugsornrat, Kessararat; Pasakon, Patiya; Karuwan, Chanpen; Sriprachuabwong, Chakrit; Maturos, Thitima; Pogfay, Tawee; Wisitsoraat, Anurat; Tuantranont, Adisorn

doi:10.1109/jsen.2019.2921789

Cited by 9 publications

(4 citation statements)

References 37 publications

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“…Furthermore, the thickness of the dielectric layer is important for optimizing the voltage required for droplet actuation using EWOD chips [ 25 , 83 ]. Ugsornrat et al found in their study that if the dielectric layer is thick, then the required voltage for actuation is high [ 70 ]. Therefore, to reduce the applied voltage, their work reduced the thickness of the dielectric layer (PDMS) by simply increasing the spin-coating speed.…”

Section: Ewod: Working Principle and Design Parametersmentioning

confidence: 99%

Electrowetting-on-dielectric (EWOD): Current perspectives and applications in ensuring food safety

Barman¹,

Khan²,

Chatterjee³

et al. 2020

Journal of Food and Drug Analysis

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Digital microfluidic (DMF) platforms have contributed immensely to the development of multifunctional lab-on-chip systems for performing complete sets of biological and analytical assays. Electrowetting-on-dielectric (EWOD) technology, due to its outstanding flexibility and integrability, has emerged as a promising candidate for such lab-on-chip applications. Triggered by an electrical stimulus, EWOD devices allow precise manipulation of single droplets along the designed electrode arrays without employing external pumps and valves, thereby enhancing the miniaturization and portability of the system towards transcending important laboratory assays in resource-limited settings. In recent years, the simple fabrication process and reprogrammable architecture of EWOD chips have led to their widespread applications in food safety analysis. Various EWOD devices have been developed for the quantitative monitoring of analytes such as food-borne pathogens, heavy metal ions, vitamins, and antioxidants, which are significant in food samples. In this paper, we reviewed the advances and developments in the design of EWOD systems for performing versatile functions starting from sample preparation to sample detection, enabling rapid and high-throughput food analysis.

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Section: Ewod: Working Principle and Design Parametersmentioning

confidence: 99%

Electrowetting-on-dielectric (EWOD): Current perspectives and applications in ensuring food safety

Barman¹,

Khan²,

Chatterjee³

et al. 2020

Journal of Food and Drug Analysis

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show abstract

“…Inorganic materials with high dielectric constant have been used for low-voltage EWOD applications with nanometric thickness, such as BST (ε = 225–265), , Ta 2 O 5 (ε = 21–28), and SiO 2 (ε = 3.9) . Processing with high temperature and vacuum are necessary to prepare these inorganic films, such as the film deposition techniques of metal organic chemical vapor deposition, plasma-enhanced chemical vapor deposition, sputtering, atomic layer deposition, and electron beam evaporation. , Organic materials such as PVDF-HFP, ETFE, PDMS, and SLIPS ,− have also been developed and applied in EWOD devices. However, these materials are either easily broken down at low thickness or high driving voltage.…”

Section: Introductionmentioning

confidence: 99%

Replaceable Dielectric Film for Low-Voltage and High-Performance Electrowetting-Based Digital Microfluidics

et al. 2023

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Electrowetting-on-dielectric (EWOD) technology has been considered as a promising candidate for digital microfluidic (DMF) applications due to its outstanding flexibility and integrability. The dielectric layer with a hydrophobic surface is the key element of an EWOD device, determining its driving voltage, reliability, and lifetime. Hereby, inspired by the ionic-liquid-filled structuring polymer with high capacitance independent on thickness, namely ion gel (IG), we develop a polymer (P)-ion gel-amorphous fluoropolymer, namely, PIGAF, composite film as a replaceable hydrophobic dielectric layer for fabrication of a high-efficiency and stable EWOD-DMF device at relatively low voltage. The results show that the proposed EWOD devices using the PIGAF-based dielectric layer can achieve a large contact angle (θ) change of ∼50° and excellent reversibility with a contact angle hysteresis of ≤5° at a relatively low voltage of 30 Vrms. More importantly, the EWOD actuation voltage did not change obviously with the PIGAF film thickness in the range of several to tens of microns, enabling the thickness of the film to be adjusted according to the demand within a certain range while keeping the actuation voltage low. An EWOD-DMF device can be prepared by simply stacking a PIGAF film onto a PCB board, demonstrating stable droplet actuation (motion) at 30 Vrms and 1 kHz as well as a maximum moving velocity of 69 mm/s at 140 Vrms and 1 kHz. The PIGAF film was highly stable and reliable, maintaining excellent EWOD performance after multiple droplet manipulations (≥50 cycles) or long-term storage of 1 year. The proposed EWOD-DMF device has been demonstrated for digital chemical reactions and biomedical sensing applications.

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“…Of late, several printing technologies (such as roll-to-roll, [7][8][9][10] screen, [11][12][13] inkjet, [14][15][16] etc.) have been used to not only form and fabricate modern-day electronic devices and structures, but also to interconnect them directly on the polymer surfaces of flexible substrates with roughness in the order of micrometers.…”

Section: Introductionmentioning

confidence: 99%

Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics

Murugesan

Susumago

Sumitani

et al. 2021

Jpn. J. Appl. Phys.

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Au redistribution layers 10 to 100 μm wide were fabricated on heterogeneously integrated advanced flexible hybrid electronics (FHE) substrates formed by a die-first approach based on fan-out wafer-level packaging. The formed Au metal wiring was meticulously studied for locally induced mechanical stress upon bending (bending radius, BR 20 mm) using Laue microdiffraction (LμD) with synchrotron radiation. It was inferred from the LμD data that upon bending the FHE substrate up to the BR of 20 mm, the Au metal wiring (10 mm long, 100 μm wide, and 500 nm thick) experienced mechanical bending stress amounting to 250 ∼ 300 MPa. The stress values obtained from the LμD studies were close to the stress value of 350 MPa obtained by simulation.

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Low-Cost and Disposable Electrowetting-on-Dielectric Lab on a Chip With an Integrated Electrochemical Detector Fabricated by Screen-Printing Process

Cited by 9 publications

References 37 publications

Electrowetting-on-dielectric (EWOD): Current perspectives and applications in ensuring food safety

Electrowetting-on-dielectric (EWOD): Current perspectives and applications in ensuring food safety

Replaceable Dielectric Film for Low-Voltage and High-Performance Electrowetting-Based Digital Microfluidics

Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics

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