Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics

Abstract

Au redistribution layers 10 to 100 μm wide were fabricated on heterogeneously integrated advanced flexible hybrid electronics (FHE) substrates formed by a die-first approach based on fan-out wafer-level packaging. The formed Au metal wiring was meticulously studied for locally induced mechanical stress upon bending (bending radius, BR 20 mm) using Laue microdiffraction (LμD) with synchrotron radiation. It was inferred from the LμD data that upon bending the FHE substrate up to the BR of 20 mm, the Au metal wiring (10 mm long, 100 μm wide, and 500 nm thick) experienced mechanical bending stress amounting to 250 ∼ 300 MPa. The stress values obtained from the LμD studies were close to the stress value of 350 MPa obtained by simulation.

Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics

“…The interconnect dimensions were determined based on static structure simulation [28][29][30] results computed using Ansys Workbench. Two typical configurations of corrugated interconnects were designed, as shown in Fig.…”