Low capacitance and highly reliable blind through-silicon-vias (TSVs) with vacuum-assisted spin coating of polyimide dielectric liners

Yan, YangYang; Xiong, Miao; Liu, Bin; Ding, Yingtao; Chen, ZhiMing

doi:10.1007/s11431-016-0266-6

Cited by 11 publications

(5 citation statements)

References 40 publications

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“…Yan et al . [58] fabricated MIS trench capacitors with a diameter of ~6 μm and depth of ~54 μm successfully with polyimide insulator step coverage better than 30% and evaluated C-V characteristics and leakage current properties of the MIS trench capacitor under thermal treatment. The experimental results showed that the minimum capacitance density was around 4.82 nF/cm 2 , and the leakage current density after 30 cycles of thermal shock tests became stable and it was around 30 nA/cm 2 under a bias voltage of 20 V.…”

Section: Polyimide (Pi)/sio 2 Applicationsmentioning

confidence: 99%

High-Performance Polymer Type Capacitors

İnan

2018

Materials Research Foundations

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This book chapter concentrates on energy storage applications of thin film containing electrochemical capacitors (supercapacitors) with specifically high-temperature polymers (fluorinated polymers, polyimides, polyarylenes, polyvinyl pyrollidone, etc.) for their good thermal and hydrolytic stability, excellent mechanical and chemical stability, low cost, flexibility and commercial availability. It consists of three main parts as given in the table of contents related to the 1) fluorinated high-performance polymers (FHPP) 2) nonfluorinated high-performance polymers (NFHPP) and 3) fluorinated and nonfluorinated high-performance polymers (FNFHPP) with their composites. A total of 141 literature reviewed references are cited.

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Section: Polyimide (Pi)/sio 2 Applicationsmentioning

confidence: 99%

High-Performance Polymer Type Capacitors

İnan

2018

Materials Research Foundations

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“…Among these approaches, vacuum-assisted polymer filling has attracted great interest due to its filling ability of high aspect ratio trenches, 31 but in the case of TSV, the conformality is still far from the requirements. 32 Several low-k polymer thin films deposited by CVD processes were also investigated for this application. Various parylenes were conformally deposited by CVD on high aspect ratio TSV (including the parylene HT that is stable at temperatures up to 400 °C).…”

Section: ■ Introductionmentioning

confidence: 99%

“…Several demonstrations of TSV insulation with low-k polymers deposited by solution techniques were also published. Various deposition technologies, including spin-coating, − spraying, and vacuum-assisted spin coating, − and various polymers (such as benzocyclobutene, , polypropylene carbonate, polybenzoxazole, and polyimide ,, ) have been investigated to achieve conformal polymer covering of trenches. Among these approaches, vacuum-assisted polymer filling has attracted great interest due to its filling ability of high aspect ratio trenches, but in the case of TSV, the conformality is still far from the requirements …”

Section: Introductionmentioning

confidence: 99%

Wafer Scale Insulation of High Aspect Ratio Through-Silicon Vias by iCVD

Jousseaume,

Guerin,

Ichiki

et al. 2024

ACS Appl. Mater. Interfaces

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In microelectronics, one of the main 3D integration strategies consists of vertically stacking and electrically connecting various functional chips using through-silicon vias (TSVs). For the fabrication of the TSVs, one of the challenges is to conformally deposit a low dielectric constant insulator thin film at the surface of the silicon. To date, there is no universal technique that can address all types of TSV integration schemes, especially in the case requiring a low deposition temperature. In this work, an organosilicate polymer deposited by initiated chemical vapor deposition (iCVD) was developed and integrated as an insulating layer for TSVs. Process studies have shown that poly(1,3,5-trivinyl-1,3,5-trimethyl cyclotrisiloxane) (P(V 3 D 3 )) can present good conformality on high aspect ratio features by increasing the substrate temperature up to 100 °C. The trade-off is a moderate deposition rate. The thermal stability of the polymer has been investigated, and we show that a thermal annealing at 400 °C (with or without ultraviolet exposure) allows the stabilization of the dielectric films by removing residual oligomers. Then, P(V 3 D 3 ) was integrated in high aspect ratio TSV (10 × 100 μm) on 300 mm silicon wafers using a standard integration flow for TSV metallization. Functional devices were successfully fabricated (including daisy chains of 754 TSVs) and electrically characterized. Our work shows that the metallization barrier should be carefully selected to eliminate the appearance of voids at the top corner of the TSV after the Cu annealing step. Moreover, an appropriate integration process should be used to avoid the appearance of cohesive cracks in the liner. This work constitutes a first proof of concept of the use of an iCVD polymer in a quasi-industrial microelectronic environment. It also highlights the benefit of iCVD as a promising technique to deposit conformal dielectric thin films in a microelectronic pilot line environment.

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“…In microsystem applications, polyimides are being used in the form of sheets, as substrates, and as thin films. For example, thin polyimide films are employed as stress‐distribution layers, [ 11 ] and dielectric interlayers [ 12 ] in electronics and microsystems. The thin polyimide films are typically realized by spin‐coating a soluble polyimide precursor on a silicon or glass substrate.…”

Section: Introductionmentioning

confidence: 99%

3D Printing by Two‐Photon Polymerization of Polyimide Objects and Demonstration of a 3D‐printed Micro‐Hotplate

Pagliano

Schröder

Stemme

et al. 2023

Adv Materials Technologies

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Polyimides are polymeric materials with outstanding thermal, chemical, and mechanical properties. For this reason, they find applications in several engineering sectors, including aerospace, microsystems, and biomedical applications. For realizing 3D structures made of polyimides, 3D printing is an attractive technique because it overcomes the limitations of polyimide processing using conventional manufacturing techniques such as molding and subtractive manufacturing. However, current polyimide 3D printing approaches are limited to realizing objects with the smallest dimensions of the order of a few hundred micrometers. 3D printing of polyimide objects featuring sub‐micrometer resolution using two‐photon polymerization by direct laser writing is demonstrated here. A negative photosensitive polyimide is applied that is widely used in microsystems applications. To demonstrate the utility of this polyimide 3D printing approach and the compatibility of the 3D objects with operation at elevated temperatures, a micro‐hotplate is 3D printed and characterized at operating temperatures of above 300 °C.

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Low capacitance and highly reliable blind through-silicon-vias (TSVs) with vacuum-assisted spin coating of polyimide dielectric liners

Cited by 11 publications

References 40 publications

High-Performance Polymer Type Capacitors

High-Performance Polymer Type Capacitors

Wafer Scale Insulation of High Aspect Ratio Through-Silicon Vias by iCVD

3D Printing by Two‐Photon Polymerization of Polyimide Objects and Demonstration of a 3D‐printed Micro‐Hotplate

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