2018 IEEE International Ultrasonics Symposium (IUS) 2018
DOI: 10.1109/ultsym.2018.8579715
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Longitudinal Leaky Surface Acoustic Wave with Low Attenuation on LiTaO3 Thin Plate Bonded to Quartz Substrate

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Cited by 10 publications
(9 citation statements)
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“…On the other hand, we reported that LSAW and LLSAW devices with piezoelectric thin plates bonded to high-velocity substrates (quartz and sapphire) have a high K 2 and high Q factor. [8][9][10][11] LLSAW devices with a piezoelectric thin plate/acoustic mirror layer substrate (IHP SAW) which possess a high K 2 and high Q factor was also reported by the manufacturers Murata. 12) However, for these layered structure fabrications, advanced bonding and polishing techniques were required to obtain a strong bonding interface and quite a thin piezoelectric plate.…”
Section: Introductionmentioning
confidence: 84%
“…On the other hand, we reported that LSAW and LLSAW devices with piezoelectric thin plates bonded to high-velocity substrates (quartz and sapphire) have a high K 2 and high Q factor. [8][9][10][11] LLSAW devices with a piezoelectric thin plate/acoustic mirror layer substrate (IHP SAW) which possess a high K 2 and high Q factor was also reported by the manufacturers Murata. 12) However, for these layered structure fabrications, advanced bonding and polishing techniques were required to obtain a strong bonding interface and quite a thin piezoelectric plate.…”
Section: Introductionmentioning
confidence: 84%
“…Elsewhere, another type of device with a similar concept employing layered LT/quartz substrate has been reported by some researchers. [16][17][18][19][20][21][22][23][24][25][26][27][28] For this type of device, the suppression of higher-order modes while keeping other characteristics has been realized by optimizing the cut angle of quartz. 26) However, since the thermal conduction of quartz is not good, the power durability of this type of device is probably inferior compared with I.H.P.…”
Section: Introductionmentioning
confidence: 99%
“…One of the key requirements for further advancement of SAW based MMAs and similar devices is finding new piezoelectric materials for the sensitive element (SE) console that could overcome typical limitations of the existing prototypes [8][9][10][11].…”
Section: Introductionmentioning
confidence: 99%