Lock-in thermography application in flip-chip packaging for short defect localization

Tay, M. Y.; Tan, M.C.; Qiu, Wentao; Zhao, Xiaole

doi:10.1109/eptc.2011.6184498

Cited by 8 publications

(2 citation statements)

References 5 publications

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“…The reflected wave oscillates at the same frequency as the thermal wave [ 106 ]. The active thermography methods have been adopted extensively to inspect the IC packaging (pulsed [ 94 , 95 , 107 , 108 ] and lock-in [ 92 , 93 , 101 , 109 ]). A sample setup (both schematic and actual) of the active thermography is shown in Figure 13 .…”

Section: Ndt Methods For Ic Packagingmentioning

confidence: 99%

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Aryan

Sampath

Sohn

2018

Sensors

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The article provides a review of the state-of-art non-destructive testing (NDT) methods used for evaluation of integrated circuit (IC) packaging. The review identifies various types of the defects and the capabilities of most common NDT methods employed for defect detection. The main aim of this paper is to provide a detailed review on the common NDT methods for IC packaging addressing their principles of operation, advantages, limitations and suggestions for improvement. The current methods such as, X-ray, scanning acoustic microscopy (SAM), infrared thermography (IRT), magnetic current imaging (MCI) and surface acoustic waves (SAW) are explicitly reviewed. The uniqueness of the paper lies in comprehensive comparison of the current NDT methods, recommendations for the improvements, and introduction of new candidate NDT technologies, which can be adopted for IC packaging.

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Section: Ndt Methods For Ic Packagingmentioning

confidence: 99%

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Aryan

Sampath

Sohn

2018

Sensors

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“…[3,4] More precisely, for quantitative studies, this technology offers the possibility to measure important experimental parameters, such as the convective heat transfer, [5] as well as to monitor the temperature distribution, [6] which can be one of the most important parameters in some experimental studies. In this study, this versatile technology has been combined with miniaturised fluidic systems that have proven to be novel and important tools for online chemical analysis and process intensification.…”

Section: Introductionmentioning

confidence: 99%

Quantitative thermal analysis of heat transfer in liquid–liquid biphasic millifluidic droplet flows

Romano

Pradère

Toutain

et al. 2014

Quantitative InfraRed Thermography Journal

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is an open access repository that collects the work of Arts et Métiers ParisTech researchers and makes it freely available over the web where possible. In this paper, infrared thermography is used to propose a simple quantitative approach toward understanding the thermal behaviour of a liquid-liquid biphasic millifluidic droplet flow under isoperibolic conditions. It is shown that due to the isoperibolic boundary condition, the thermal behaviour at the established periodic state can be managed according to different orders, i.e. either a continuous or fluctuating contribution. A complete analytical solution is proposed for the complex problem model, then a simplified model is proposed. Finally, a simple homogeneous equivalent thin body model approximation with a characteristic coefficient function of a biphasic flow mixing law is sufficient for describing the thermal behaviour of the media under isoperibolic conditions. From this theoretical validation, the experimental results concerning the behaviour of a biphasic oil and droplet flow are presented. An analytical representation law is proposed to quantitatively estimate and predict the thermal behaviour of the flow. Moreover, it is demonstrated that with this new method, the thermophysical properties of the phase can be estimated with a deviation less than 5% from that reported by the suppliers.

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Advanced failure analysis techniques for SiP defect location and mechanism analysis

Lin¹,

Chen²,

Li³

2013

2013 14th International Conference on Electronic Packaging Technology

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Lock-in thermography application in flip-chip packaging for short defect localization

Cited by 8 publications

References 5 publications

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Quantitative thermal analysis of heat transfer in liquid–liquid biphasic millifluidic droplet flows

Advanced failure analysis techniques for SiP defect location and mechanism analysis

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