Localized TIM characterization using deconstructive analysis

Fosnot, Phillip; Galloway, Jesse

doi:10.1109/semi-therm.2015.7100169

Cited by 3 publications

(2 citation statements)

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“…Measurements of the thermal properties of the TIM1 needs to prepare special samples and design and manufacture dedicated measurement setup (Figure 2; Burzo and Li, 2018; Fenech et al , 2020; Fosnot and Galloway, 2015; Kisiel et al , 2021). The special sample for thermal measurements consists of two Cu sheets single side galvanically covered by Ni/Au joined together with investigated paste (TIM1).…”

Section: Experiments and Test Methodologymentioning

confidence: 99%

“…Measurements of the thermal properties of the TIM1 needs to prepare special samples and design and manufacture dedicated measurement setup (Figure 2; Burzo and Li, 2018;Fenech et al, 2020;Fosnot and Galloway, 2015;Kisiel et al, 2021). The Next, subtracting known thermal resistance two sheets Cu, desired value of thermal resistance is calculated.…”

Section: Experiments and Test Methodologymentioning

confidence: 99%

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Influence of Ag particle shape on mechanical and thermal properties of TIM joints

Myśliwiec

Kisiel

Kruszewski

2022

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Purpose The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (better than for SAC solders) are the goal of this research. Design/methodology/approach Mechanical and thermal properties of TIM joints between gold plated contacts of chip and substrate were investigated. Sintering technique based on Ag pastes was applied for purpose of this study. Performance properties were assessed by shear force tests and thermal measurements. Scanning electron microscopy was used for microstructural observations of cross-section of formed joints. Findings It was concluded that the best properties are achieved for pastes containing spherical Ag particles of dozens of micrometer size with flake shaped Ag particles of few micrometers size. Sintering temperature at 230°C and application of 1 MPa force on the chip during sintering gave the higher adhesion and the lowest thermal interface resistance. Originality/value The new material based on Ag paste containing mixtures of Ag particles of different size (form nanometer to dozens of microns) and shape (spherical, flake) suspended in resin was proposed. Joints prepared using sintering technique and Ag pastes at 230°C with applied pressure shows better mechanical and thermal than other TIM materials such as thermal grease, thermal gel or thermally conductive adhesive. Those material could enable electronic device operation at temperatures above 200°C, currently unavailable for Si-based power electronics.

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Section: Experiments and Test Methodologymentioning

confidence: 99%

“…Measurements of the thermal properties of the TIM1 needs to prepare special samples and design and manufacture dedicated measurement setup (Figure 2; Burzo and Li, 2018;Fenech et al, 2020;Fosnot and Galloway, 2015;Kisiel et al, 2021). The Next, subtracting known thermal resistance two sheets Cu, desired value of thermal resistance is calculated.…”

Section: Experiments and Test Methodologymentioning

confidence: 99%