2017 33rd Thermal Measurement, Modeling &Amp; Management Symposium (SEMI-THERM) 2017
DOI: 10.1109/semi-therm.2017.7896936
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Junction to case thermal resistance variability due to temperature induced package warpage

Thomas Nordstog
1
,
Christopher Henry
2
,
Cameron Nelson
3
et al.
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Cited by 3 publications
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References 24 publications
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Transient Thermal Characterization of Junction to Case Thermal Resistance for 2.5D Packages

Zhang
1
,
Sui
2
,
Lin
3
et al. 2018
2018 19th International Conference on Electronic Packaging Technology (ICEPT)
2
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Transient Thermal Characterization of Junction to Case Thermal Resistance for 2.5D Packages

Zhang
1
,
Sui
2
,
Lin
3
et al. 2018
2018 19th International Conference on Electronic Packaging Technology (ICEPT)
2
0
1
0
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The Effect of Thermal-Induced Warpage and Degeneration of Thermal Interface Materials on the Thermal Performance of a Flip-Chip Package

Jiang
1
,
Zhonz
2
,
Wang
3
et al. 2021
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
2
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Analytical Solution for a Chip Temperature Distribution in a Multilayer Chip-Package with Thermal Warpage

Jain1,
Parekh2,
Bergendahl3
et al. 2021
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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