Localization and Detection of Bond Wire Faults in Multichip IGBT Power Modules

Chen, Cuili; Pickert, Volker; Al‐Greer, Maher; Jia, Chun‐Jiang; Ng, Chong

doi:10.1109/tpel.2020.2965019

Cited by 25 publications

(8 citation statements)

References 18 publications

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“…If the current Ic is given with (12), then for inverter operation the duty-variation (PWM pulse pattern) of the IGBTif a suitably fast switching frequency is assumedcan be written as (13) [31].…”

Section: B Converter Thermal Loading Modelmentioning

confidence: 99%

“…This information can be taken forward to design more reliable systems or mechanisms that will help extend converter lifetime. This model can be combined with a detailed failure detection and localization method such as in [12] where it will be used as an additional parameter to make the localization faster and more accurate.…”

Section: B Assessment Of Consumed Lifetimementioning

confidence: 99%

See 1 more Smart Citation

Modelling of Wind Turbine Operation for Enhanced Power Electronics Reliability

Ahmedi

Barnes

Leví

et al. 2022

IEEE Trans. Energy Convers.

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Section: B Converter Thermal Loading Modelmentioning

confidence: 99%

Section: B Assessment Of Consumed Lifetimementioning

confidence: 99%

Modelling of Wind Turbine Operation for Enhanced Power Electronics Reliability

Ahmedi

Barnes

Leví

et al. 2022

IEEE Trans. Energy Convers.

Self Cite

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“…We employed the measured thermal resistance, Rth, as a criterion for determining the accuracy of our simulations. Of course, electrical characteristics are also popularly used as critical factors describing the performance and reliability of a developed power module [32,33]. However, in this work, it is difficult to perform a one-to-one comparison of the characterized electrical parameters (e.g., VCE(ON) or RCE(ON) values) with the electrical FEM simulation results in Figs.…”

Section: Performance Evaluation Of the Fabricated Power Modulementioning

confidence: 99%

Iterative Electrical–Thermal Coupled Simulation Method of Automotive Power Module Used in Electric Power Steering System

et al. 2021

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This paper presents a multi-physics analysis coupling the electrical and thermal properties of a power module. As power modules have multi-physical behaviors, it is important to simulate their multiphysical characteristics. Simulations of these characteristics have been separately conducted using specific software; however, as these characteristics are often coupled, it is difficult to fully understand the multiphysical nature of power modules. This paper proposes a method to analyze the coupled characteristics of a power module in an iterative manner. The analyzed module is designed for an automotive electric power steering (EPS) system. We fabricated the EPS module and measured its electrical and thermal characteristics, which were used for reference. For the coupled simulation, we employed ANSYS Icepak and Q3D Extractor for thermal and electrical simulations, respectively, linked them to the ANSYS workbench environment, and conducted an iterative feedback simulation until the simulated results converged. The coupled simulation demonstrated that the parasitic resistance and volume loss density of the power module are increased by ~50% compared to the those obtained from a separately conducted electrical simulation due to the impact of the linked thermal simulation. As a result, the simulated thermal resistance increased to 0.26 K/W, which is almost identical to the measured value of ~0.27 K/W. Therefore, our iterative electrical-thermal coupled simulation exhibits more accurate results than the conventional separate simulations.

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“…The acceptable number of chip losses for IGBT modules depends on the working environment and working requirements. Generally, 10% chip losses in IGBT modules and 70% bond wire lift-off on the chip are considered acceptable [23]. Therefore, for the DIM800NSM33-F IGBT module, the detection of two chip failures in 16 chips is set as the safety margin.…”

Section: Multi-chip Igbt Module Failure Mechanism and Structurementioning

confidence: 99%

Multi-Chip IGBT Module Failure Monitoring Based on Module Transconductance with Temperature Calibration

Wang

Chuan-kun

et al. 2020

Electronics

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The Insulated Gate Bipolar Transistor (IGBT) is the component with the highest failure rate in power converters, and its reliability is a critical issue in power electronics. IGBT module failure is largely caused by solder layer fatigue or bond wires fall-off. This paper proposes a multi-chip IGBT module failure monitoring method based on the module transconductance, which can accurately monitor IGBT module chip failures and bond wire failures. The paper first introduces the failure mechanism and module structure of the multi-chip IGBT module; then, it proposes a reliability model based on the module transconductance and analyzes the relationship between chip failure, bond wire failure, and the transmission characteristic curve of the IGBT module. Finally, the module transconductance under chip failure and bond wire failure is measured and calculated through simulation, and the temperature is calibrated, which can eliminate the influence of temperature on health monitoring. The results show that the method has a high sensitivity to chip failures and bond wire failures, can realize the failure monitoring of multi-chip IGBT modules, and is of great significance for improving the reliability of power converters.

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Localization and Detection of Bond Wire Faults in Multichip IGBT Power Modules

Cited by 25 publications

References 18 publications

Modelling of Wind Turbine Operation for Enhanced Power Electronics Reliability

Modelling of Wind Turbine Operation for Enhanced Power Electronics Reliability

Iterative Electrical–Thermal Coupled Simulation Method of Automotive Power Module Used in Electric Power Steering System

Multi-Chip IGBT Module Failure Monitoring Based on Module Transconductance with Temperature Calibration

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