2010
DOI: 10.1007/s12274-010-1013-5
|View full text |Cite
|
Sign up to set email alerts
|

Lithography-free fabrication of high quality substrate-supported and freestanding graphene devices

Abstract: We present a lithography-free technique for fabrication of clean, high quality graphene devices. This technique is based on evaporation through hard Si shadow masks, and eliminates contaminants introduced by lithographical processes. We demonstrate that devices fabricated by this technique have significantly higher mobility values than those obtained by standard electron beam lithography. To obtain ultra-high mobility devices, we extend this technique to fabricate suspended graphene samples with mobilities as … Show more

Help me understand this report
View preprint versions

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
84
1

Year Published

2011
2011
2023
2023

Publication Types

Select...
8

Relationship

3
5

Authors

Journals

citations
Cited by 89 publications
(85 citation statements)
references
References 19 publications
0
84
1
Order By: Relevance
“…Two different types of BLG devices are fabricated: (i) Graphene sheets are exfoliated on substrates or across predefined trenches that are 250 nm deep and approximately 3 μm wide, then coupled to 5-nm∕50-nm Ti∕Al metal electrodes through shadow mask evaporation (42). The typical back-gate coupling ratio of such devices is approximately 2.5 × 10 10 cm −2 V −1 .…”
Section: Methodsmentioning
confidence: 99%
“…Two different types of BLG devices are fabricated: (i) Graphene sheets are exfoliated on substrates or across predefined trenches that are 250 nm deep and approximately 3 μm wide, then coupled to 5-nm∕50-nm Ti∕Al metal electrodes through shadow mask evaporation (42). The typical back-gate coupling ratio of such devices is approximately 2.5 × 10 10 cm −2 V −1 .…”
Section: Methodsmentioning
confidence: 99%
“…We are the fi rst to propose and confi rm the battery performance improvement by such a new charging strategy in the fi rst cycle, which is possible based on the fundamental studies at the nanoscale. Cu electrodes (50-nm thickness) are then deposited on top of selected MoS 2 sheets using a shadow mask technique [ 35 ] in an electron beam evaporator. For resistance measurements, Hall bar electrodes are predeposited on glass substrates, and mechanically exfoliated MoS 2 crystals are then transferred onto the electrodes (Supporting Information Figure S3).…”
Section: Doi: 101002/aenm201401742mentioning
confidence: 99%
“…Single Lorentzian fitting of the 2D peak [see inset Fig.1 (c)] with I(2D)/I(G)= 3.4 confirms SLG 35 . Initially, to avoid contamination from wet chemical process and resist used in lithography steps, a mechanical shadow-masking method 36 was followed for electrical contacts. Cr(10nm)/Au(50nm) was deposited twice after masking the graphene flake using 50µm (or 25µm) diameter tungsten wires [see Fig.1(b)] under optical microscope.…”
Section: Methodsmentioning
confidence: 99%