2011
DOI: 10.1117/12.879218
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Litho process control via optimum metrology sampling while providing cycle time reduction and faster metrology-to-litho turn around time

Abstract: In keeping up with the tightening overall budget in lithography, metrology requirements have reached a deep subnanometer level [1]. This drives the need for clean metrology (resolution and precision). Results have been published of a thorough investigation of a scatterometry-based platform from ASML [7], showing promising results on resolution, precision, and tool matching for overlay, CD and focus [2 -6].But overall requirements are so extreme that all measures must be taken in order to meet them. In light of… Show more

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Cited by 5 publications
(2 citation statements)
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“…Both FEOL and BEOL layer results on mean and P2P (point-to-point) matching are reported from 3 production YieldStar tools where they are compared with a 4 th production YieldStar using a 204 point measurement scheme. Fast time to react, cycle time saving, excursion detection and short lot logistics are a few benefits of integrated metrology [3]. Typically overlay corrections while using integrated metrology are available 2 -5 hours earlier than with standalone metrology; for 30 critical layers, this means 60 -150 hours (up to 6 days) of production cycle time reduction.…”
Section: Tool-to-tool Matchingmentioning
confidence: 99%
“…Both FEOL and BEOL layer results on mean and P2P (point-to-point) matching are reported from 3 production YieldStar tools where they are compared with a 4 th production YieldStar using a 204 point measurement scheme. Fast time to react, cycle time saving, excursion detection and short lot logistics are a few benefits of integrated metrology [3]. Typically overlay corrections while using integrated metrology are available 2 -5 hours earlier than with standalone metrology; for 30 critical layers, this means 60 -150 hours (up to 6 days) of production cycle time reduction.…”
Section: Tool-to-tool Matchingmentioning
confidence: 99%
“…Integrated Metrology reduces hereby the cycle time [3], utilizing diffraction based DBO, DBF and CD measurements generates the accurate data that are needed for high order process control!. As the requirements for on-product overlay (OPO) and overall process window tolerances continue to tighten for the upcoming technology nodes we show in this paper how the new YieldStar 350E (YS350E) metrology system addresses these challenges.…”
Section: Introductionmentioning
confidence: 98%