2013
DOI: 10.1016/j.solmat.2013.01.037
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Liquid silicate additive for alkaline texturing of mono-Si wafers to improve process bath lifetime and reduce IPA consumption

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Cited by 55 publications
(21 citation statements)
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“…Brief details regarding the texturisation process recipes are given in Table 1. The role of the K 2 SiO 3 additive in KOH-IPA texturisation baths is discussed in reference [14]. With each of the three texture processes, forty five p-type Cz wafers (156 mm  156 mm, pseudosquare, 1-2 Ω cm resistivity) were textured and used for fabricating standard screen-printed solar cells with the following process sequence after texturisation: inline P emitter diffusion followed by inline chemical edge isolation and emitter etch back (final emitter sheet resistance 70 Ω/sq, surface dopant concentration $ 3  10 20 cm À 3 ) [25], front PECVD amorphous silicon nitride (SiN x ) coating, screen printing (front Ag paste: DuPont PV 17F, rear Al paste: Monocrystal PASE 12D), co-firing.…”
Section: Methodsmentioning
confidence: 99%
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“…Brief details regarding the texturisation process recipes are given in Table 1. The role of the K 2 SiO 3 additive in KOH-IPA texturisation baths is discussed in reference [14]. With each of the three texture processes, forty five p-type Cz wafers (156 mm  156 mm, pseudosquare, 1-2 Ω cm resistivity) were textured and used for fabricating standard screen-printed solar cells with the following process sequence after texturisation: inline P emitter diffusion followed by inline chemical edge isolation and emitter etch back (final emitter sheet resistance 70 Ω/sq, surface dopant concentration $ 3  10 20 cm À 3 ) [25], front PECVD amorphous silicon nitride (SiN x ) coating, screen printing (front Ag paste: DuPont PV 17F, rear Al paste: Monocrystal PASE 12D), co-firing.…”
Section: Methodsmentioning
confidence: 99%
“…Care should also be taken to achieve a narrow range of heights in the distribution (low standard deviation). Such a tailoring of pyramid height distributions may be achieved by using additives [14][15][16][17][18][19] to improve the control over alkaline texturisation processes in tandem with statistical characterisation of pyramid height distributions. These guidelines are developed for the case when current conduction through Ag crystallites is prevalent at the Ag/n þ Si interface.…”
Section: Guidelines To Tailor Pyramid Height Distributionsmentioning
confidence: 99%
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“…The wafers were saw damage etched and textured in KOH/IPA/potassium silicate solution at 80 • C [13] to generate a random pyramid surface texture on both sides. The emitter diffusion was carried out using an industrial inline diffusion furnace (Despatch, DCF-3615), which has a doper section that feeds the wafers directly to a belt furnace for diffusion.…”
Section: A Sample Preparationmentioning
confidence: 99%
“…However, high concentration of KOH causes instability in the solution and etching rate. Therefore, uncontrolled nonuniformity in texturing occurs, and incomplete coverage of the pyramidal textured surface and wide variation in pyramid size can be seen . One of the solutions for the stability problem and thus lower the production cost is to apply an additional agitation that can help to lower the temperature of the solution for a stable IPA concentration.…”
Section: Introductionmentioning
confidence: 99%