1970
DOI: 10.1016/0022-0248(70)90072-2
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Liquid phase epitaxy on zinc telluride

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1972
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Cited by 16 publications
(3 citation statements)
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“…Defects in the shape of cones, platelets, protrusions, and various dendritic structures usually appear after etching. In practice, we have found the impurity concentrations in these defects to be below the detection level presently achieved by mass spectrometry and electron-probe microanalysis in agreement with Yanagawa (1) and Green (2). In this note we report new results on the chemical constituents of a number of chemical defects observed in processed silicon devices.…”
Section: Brief Co Nn Un Ca Onsupporting
confidence: 79%
“…Defects in the shape of cones, platelets, protrusions, and various dendritic structures usually appear after etching. In practice, we have found the impurity concentrations in these defects to be below the detection level presently achieved by mass spectrometry and electron-probe microanalysis in agreement with Yanagawa (1) and Green (2). In this note we report new results on the chemical constituents of a number of chemical defects observed in processed silicon devices.…”
Section: Brief Co Nn Un Ca Onsupporting
confidence: 79%
“…[3][4][5][6] Also, ZnTe thin films have been fabricated by epitaxial growth techniques. [7][8][9][10] However, little work has been reported on the synthesis of efficient luminescent ZnTe for powder phosphor applications. The photoluminescence of doped ZnTe has been widely reported, 3,4,[8][9][10][11][12][13][14][15][16][17][18] with effective dopants including oxygen, 3,[11][12][13][14][15][16][17] copper, 4,18 ytterbium, 9 arsenic, 10 etc.…”
Section: Introductionmentioning
confidence: 99%
“…La première méthode nécessite une double épitaxie et impose l'utilisation de solvants comme le zinc ou le tellure ou bien de solvants métalliques tels Bi, Pb, Sn, Ga, In [17] ou encore d'halogénures comme ZnCl2 [18J. Ces solvants présentent divers inconvénients : forte tension de vapeur (cas du Zn, Te, ZnCI2), introduction excessive du solvant dans le dépôt (cas des autres solvants).…”
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