Zirconium oxide thin films have been deposited by atomic layer epitaxy (ALE) using Zr(thd) 4 , Cp 2 Zr(CH 3 ) 2 and Cp 2 ZrCl 2 (thd~3,3,5,5-tetramethylheptane-3,5-dionate, Cp~cyclopentadienyl) as zirconium precursors and ozone as the oxygen source. A plateau of constant growth rate (ALE window) was observed for the Zr(thd) 4 / O 3 process at 375-400 uC, for Cp 2 Zr(CH 3 ) 2 /O 3 at 310-365 uC and for Cp 2 ZrCl 2 /O 3 at 275-350 uC. Within these temperature ranges constant deposition rates of 0.24, 0.55 and 0.53 A ˚(cycle) 21 were obtained, respectively. Deposited films were characterised by XRD and AFM for crystallinity and surface morphology, while TOF-ERDA was used to analyse the ZrO 2 film stoichiometry and possible impurities. Films deposited by optimised parameters from Cp 2 Zr(CH 3 ) 2 /O 3 and Cp 2 ZrCl 2 /O 3 were crystalline showing the preferred (2111) orientation of monoclinic ZrO 2 . In all films, the orthorhombic zirconia phase was also present, although at higher temperatures its relative amount decreased. Zr(thd) 4 /O 3 process produced films with lowest crystallinity consisting of both orthorhombic and monoclinic phases. According to TOF-ERDA, films were nearly stoichiometric with less than 0.5 atom% hydrogen and carbon. Outside the ALE window, a small chlorine contamination (0.1-0.3 wt%) was observed by XRF when the ZrO 2 films were deposited from Cp 2 ZrCl 2 /O 3 at 200-275 uC.