Proceedings of the 28th Conference on ACM/IEEE Design Automation Conference - DAC '91 1991
DOI: 10.1145/127601.127735
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Linking TCAD to EDA---benefits and issues

Abstract: This paper shows the benefits of a tighter coupling between Technology CAD and Electronic Design Automation (EDA) for the design of high speed digital and analog circuits, for the design of more manufacturable systems with improved reliability, and for future technology and circuit development. Requirements for incorporating TCAD and EDA into a framework are presented.

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Cited by 6 publications
(2 citation statements)
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“…For example, in VLSI design, process, device and circuit simulation tools are normally used as separate modules. The integration of these separate modules results in efficient IC design and development [1]. Such integration also helps to capture physical phenomena such as electromigration, ESD (electro-static discharge), oxide breakdown and latch-up that are difficult to capture except by circuit simulation [1].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…For example, in VLSI design, process, device and circuit simulation tools are normally used as separate modules. The integration of these separate modules results in efficient IC design and development [1]. Such integration also helps to capture physical phenomena such as electromigration, ESD (electro-static discharge), oxide breakdown and latch-up that are difficult to capture except by circuit simulation [1].…”
Section: Introductionmentioning
confidence: 99%
“…The integration of these separate modules results in efficient IC design and development [1]. Such integration also helps to capture physical phenomena such as electromigration, ESD (electro-static discharge), oxide breakdown and latch-up that are difficult to capture except by circuit simulation [1]. The integration process also shortens the development cycle for new technologies by providing accurate device behaviour within the circuit environment.…”
Section: Introductionmentioning
confidence: 99%