Conference Record of the Twenty-Ninth IEEE Photovoltaic Specialists Conference, 2002.
DOI: 10.1109/pvsc.2002.1190542
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Light-induced lifetime degradation of commercial multicrystalline silicon wafers

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“…2 The effect of the BO defect is less important in multicrystalline wafers, because these have a lower undegraded lifetime to start with (due to other defects) and the oxygen concentration is generally lower. [3][4][5] In this paper we present another explanation for the discrepancy between modelled and empirical optimal base resistivity. This explanation is inherent in the relation between base resistivity and carrier recombination through impurities in the Shockley-Read-Hall (SRH) model, and is relevant for several common transition metal impurities.…”
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confidence: 99%
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“…2 The effect of the BO defect is less important in multicrystalline wafers, because these have a lower undegraded lifetime to start with (due to other defects) and the oxygen concentration is generally lower. [3][4][5] In this paper we present another explanation for the discrepancy between modelled and empirical optimal base resistivity. This explanation is inherent in the relation between base resistivity and carrier recombination through impurities in the Shockley-Read-Hall (SRH) model, and is relevant for several common transition metal impurities.…”
mentioning
confidence: 99%
“…The BO defect in multicrystalline silicon has been studied in several papers. [3][4][5] Because absolute capture cross-sections of this defect are not known, the relation between defect density and degradation of lifetime (from i to f ) is expressed through a 'normalized defect density' N t * :…”
mentioning
confidence: 99%
“…Thus, the carrier recombination rate increases inside the substrate as the annealing temperature increases. This increase in the recombination rate is probably ascribed to an increase in the number of activated recombination centers induced by configuration of dopant-oxygen complexes 28,29) and by displacement of heavy metals to electrical active sites during the thermal annealing process. [30][31][32] 3.2 Examination of low-temperature cleaning process for the emitter layer growth From the dependence of the bulk lifetime on the thermal annealing temperature described in Sect.…”
Section: Dependence Of P-si Bulk Lifetime On Thermal Annealing Temper...mentioning
confidence: 99%