Wafer bonding and laser lift-off (LLO) processes were employed to fabricate pattern sapphire thin-GaN light-emitting diodes LEDs (PT-LED). During the LLO process, the required laser energy for PT-LED was much higher than that for flat thin-GaN LED (FT-LED). The yield rate of PT-LED was low, and the leakage current was high. In this study, the laser lift-off mechanisms of PT-LEDs were investigated. © The Author(s) 2014. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited. [DOI: 10.1149/2.0101502jss] All rights reserved.Manuscript submitted October 6, 2014; revised manuscript received November 11, 2014. Published November 22, 2014 GaN-based light-emitting diodes (LEDs) are usually grown on sapphire substrate. Epitaxial growth techniques have significantly improved their luminance intensity. However, the poor electrical and thermal conductivities of sapphire substrate have a negative effect on the LED performance.1,2 Thin-GaN LED process can solve these problems, [3][4][5] in which GaN LED epi-layer was stripped off and transferred to conductive substrates by wafer bonding and laser lift-off (LLO) technologies.
1,2In addition, pattern sapphire substrate (PSS) has been employed to improve both internal quantum efficiency (IQE) and light-extraction efficiency (LEE). This is because most of the growth of GaN is initiated from c-planes. With an increase in growth time, GaN epi-layers initiated from the bottom c-plane covered patterns by lateral growth, causing the threading dislocation to bend, and resulting in the improvement of epilayer quality and IQE.6-8 Also, these patterns can redirect photons back into the escape cone. As a result, LEE was improved. 5,6,9 It is obvious that a combination of the advantages of PSS-LED with the thin-GaN LED process will improve the LED performance. [10][11][12][13][14][15] However, compared with conventional flat thin-GaN LED (FT-LED), the critical laser energy of PT-LED was high, 14 the yield rate was very low, and the leakage current was high. 15 In this study, the requirement of high laser energy and the root causes of low yield rate and high leakage current were investigated.
ExperimentalPSS-LED was used to fabricate PT-LED by bonding and LLO technologies. The patterns on sapphire are shown in Fig. 1a. The width of period pattern was 2.3 μm, the space was 0.7 μm, and the height was 1.5 μm. The LED structure was grown by metal-organic chemical vapor deposition (MOCVD) 1,2 The LED wafer was then bonded to a p-type Si substrate with a metal layer. 3 The LLO process used a KrF pulsed excimer laser (248 nm) as the laser source. The pulse length of KrF laser was 38 ns. For the purpose of comparison, LED grown on flat sapphire substrate was also used to fabricate thin-GaN LED, designated as "FLAT-thin-GaN LED (FT-LED)".
Results and DiscussionAfter LLO, fo...