Life cycle inventory development for wafer fabrication in semiconductor manufacturing

Murphy, C.F.; Laurent, Jean Philippe; Allen, David T.

doi:10.1109/isee.2003.1208089

Cited by 12 publications

(9 citation statements)

References 1 publication

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“…The LCI library is composed of individual generic process steps, an approach which has been advanced in previous literature [6][1] [13], and these steps are grouped into modules for (i) Silicon on Insulator (SOI), (ii) Shallow Trench Isolation (STI), (iii) gate, (iv) interconnect, (v) passivation and (vi) bonding pad. Beneficial qualities of a structure of individual process steps grouped into modules include:…”

Section: A Discussion Of Resultsmentioning

confidence: 99%

Life Cycle Inventory of a CMOS Chip

Boyd¹,

Dornfeld²,

Krishnan³

2006

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.

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Abstract-A life cycle inventory for comparative assessment of assorted semiconductor device types is assembled using a library of process step-related information. In this paper, we present the structure of this library of energy use, material inputs and emissions data at the process equipment-level and facilities-scale, normalized per wafer. Selected results from a case study of a 130nm node CMOS device are presented and compared with a previous study of a comparable chip. Comparative production impacts of 6-layer and 8-layer CMOS devices are shown.

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Section: A Discussion Of Resultsmentioning

confidence: 99%

Life Cycle Inventory of a CMOS Chip

Boyd¹,

Dornfeld²,

Krishnan³

2006

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.

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“…Spielmann [10] and Schischke et al [11] pointed out that LCAs for the production of electronics should focus on the evaluation of generic data for suppliers of components, a modularisation of the infrastructure processes in semiconductor manufacturing, frequent up to date evaluation of the semiconductor processes, and knowledge exchange between experts on how to make the LCA methodology leaner. Also Murphy et al [12] and Schischke et al [11] have developed process-based, generic parametric modules used to manage wafer fabrication LCI data. Moreover, the Danish Environmental Protection Agency [13] has developed a method for environmental assessment of electronic products at the early stage of product development.…”

Section: Earlier Approaches To Environmental Life Cycle Assessment Ofmentioning

confidence: 99%

Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model

Andrae

Andersson

Liu

2005

Journal of Cleaner Production

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“…Finally, there is no available literature focusing specifically on the LCA of BCP and brush lithography techniques in the semiconductor industry. However, publications on LCA of the semiconductor industry do exist and have become more numerous since the 2000s [47][48][49][50].…”

Section: Introductionmentioning

confidence: 99%

Green Nanofabrication Opportunities in the Semiconductor Industry: A Life Cycle Perspective

Mullen

Morris

2021

Nanomaterials

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The turn of the 21st century heralded in the semiconductor age alongside the Anthropocene epoch, characterised by the ever-increasing human impact on the environment. The ecological consequences of semiconductor chip manufacturing are the most predominant within the electronics industry. This is due to current reliance upon large amounts of solvents, acids and gases that have numerous toxicological impacts. Management and assessment of hazardous chemicals is complicated by trade secrets and continual rapid change in the electronic manufacturing process. Of the many subprocesses involved in chip manufacturing, lithographic processes are of particular concern. Current developments in bottom-up lithography, such as directed self-assembly (DSA) of block copolymers (BCPs), are being considered as a next-generation technology for semiconductor chip production. These nanofabrication techniques present a novel opportunity for improving the sustainability of lithography by reducing the number of processing steps, energy and chemical waste products involved. At present, to the extent of our knowledge, there is no published life cycle assessment (LCA) evaluating the environmental impact of new bottom-up lithography versus conventional lithographic techniques. Quantification of this impact is central to verifying whether these new nanofabrication routes can replace conventional deposition techniques in industry as a more environmentally friendly option.

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Life cycle inventory development for wafer fabrication in semiconductor manufacturing

Cited by 12 publications

References 1 publication

Life Cycle Inventory of a CMOS Chip

Life Cycle Inventory of a CMOS Chip

Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model

Green Nanofabrication Opportunities in the Semiconductor Industry: A Life Cycle Perspective

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