Life cycle assessment of DRAM in Taiwan's semiconductor industry

Liu, C. H.; Lin, Sue J.; Lewis, Charles

doi:10.1016/j.jclepro.2009.10.004

Cited by 39 publications

(12 citation statements)

References 15 publications

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“…memory wafer having 1,100 gross Si die, i.e. 0.13 kg/Si die (Liu et al 2010). Boyd et al reported 6 kg CO 2 e/Si die for a 300-mm 0.775-mm-thick 45-nm node CMOS wafer with 590 gross silicon die (Boyd et al 2009).…”

Section: Methodsmentioning

confidence: 99%

Life cycle assessment of integrated circuit packaging technologies

Andrae

Andersen

2011

Int J Life Cycle Assess

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Background, aim and scope Nanostructured polymer particles are produced to be used in ball grid array (BGA) and chip scale packaging (CSP). The technology could replace conventional BGA and CSP metal balls, and the hypothesis is that the shift could be eco-efficient as polymer core particles increase the reliability. For the first time, these particles are environmentally evaluated. Materials and methods The change in GWP100 and EcoIndicator'99 (H) scores when replacing traditional component packaging, here quad flat pack to BGA/CSP, was explored both on component and printed circuit board assembly (PCBA) level. This was followed by comparisons between BGA packages using different types of metal-plated monodispersed polymer particle (MPP) balls and conventional balls, respectively. Results and discussion For BGAs, the silicon (Si) die dominates CO 2 e emissions, but for Eco-Indicator'99(H), solder balls are not negligible. Excluding the Si die and component assembly, the LFBGA-84 to WCSP-64 would reduce CO 2 e by about 98% and Eco-Indicator'99 (H) by about 90%. Overall, for BGA-256 using same size balls, gold-plated MPP technology decreases the Eco-Indicator'99 (H) score by about 25% compared to Pb-based or Pb-free balls. Gold production dominated GWP100 and EcoIndicator'99 (H) for the gold-plated MPP. Each microsystem is unique, and new environmental impact estimations must be done for the sub-structures of each electronic device. Screening process-sum life cycle assessment (LCA) gives similar understanding of impacts as resource productivity methods. Even though the metal mass per ball is greatly reduced, it is a weak indicator of environmental impacts which are driven by each material's specific environmental characteristics.Conclusions The ball share of the BGA-256 GWP100 and Eco-Indicator'99 (H) score is small, and the BGA/CSP producers can marginally improve the environmental performance by focusing on the balls. On a comparable IC packaging basis, the introduction of WCSP packaging technology implies a significant environmental footprint reduction. On PCBA level, the contribution of BGA balls is negligible. Results for metal-plated MPP BGA balls suggest that gold usage is the key environmental performance indicator of interest. Recommendations and perspectives Even though WCSP clearly reduces the component level impacts, the PCBA (board) level impact could increase as the CSP miniaturisation is paralleled with more PWB layers. This effect should be included in further system expansions. For LCA, in general, update of all LCIA methods, which include ozone depletion, with the latest results for dinitrogen monoxide is needed.

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Section: Methodsmentioning

confidence: 99%

Life cycle assessment of integrated circuit packaging technologies

Andrae

Andersen

2011

Int J Life Cycle Assess

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“…Hansen, 1999) and sometimes uncritically. It is often recommended that if weighting is used, several weighting methods should be used in order to illustrate the difference between different methods The use of weighting in LCA can be illustrated by several recent papers in this journal where weighting have been used, often Ecoindicator (Mahgoub et al, 2010, Contreras et al, 2009, Kiwjaroun et al, 2009, Liu et al, 2010, Tsoutsos et al, 2010, Zackrisson, 2005 or the EPS method (Zackrisson, 2005), whereas one paper calls for MultiCriteria Decision Analysis tools (Gaudreault et al, 2009). The broad use of Ecoindicator is interesting since this method is now quite old and is not available in peer-reviewed publications.…”

Section: Classification a Qualitative Step Where The 'Interventions'mentioning

confidence: 99%

Weighting and valuation in selected environmental systems analysis tools – suggestions for further developments

Ahlroth

Nilsson

Finnveden

et al. 2011

Journal of Cleaner Production

136

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“…Boyd et al (2009Boyd et al ( , 2010) developed a life cycle energy analysis for complementary metal-oxidesemiconductor and digital logic chips over seven technology nodes to compare energy demand and GWP impacts of the life cycle stages, respectively. Liu et al (2010) selected two life cycle assessment (LCA) methods to evaluate the GWP from direct/indirect CO 2 emissions and energy consumption of production equipment, which are the major environmental impacts of dynamic random access memory products. Higgs et al (2010) focused on the energy and CO 2 impacts associated with the creation of high-puritygrade materials that are required for semiconductor manufacturing.…”

Section: Introductionmentioning

confidence: 99%

Developing a parametric carbon footprinting tool for the semiconductor industry

Huang

Yin

et al. 2015

Int. J. Environ. Sci. Technol.

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The advent of global awareness of sustainable development resulted in consumer demand for low-carbon electronic products. Thus, semiconductor industry has to develop additional core competencies in that direction to remain competitive. The present study aims to establish a parametric-based tool that can identify key parameters of the complicated manufacturing processes in the semiconductor industry to simplify the calculation of the carbon footprint of products (CFP). Six regression models for CFP were developed by applying process and statistical analyses on 7114 wafer products. Results indicate that these regression models with the three key parameters (mask layer, metal layer, and technology node) can effectively predict the CFP of wafer with six different function types because the adjusted R 2 of all regression models was [0.5. Moreover, the mask layer could be the most important parameter for predicting CFP of wafer because of its higher standardized coefficients (b) in each regression model. This methodology reduces the time, cost, and information requirements of the product in traditional life cycle assessment. The proposed method introduces criteria for low-carbon decision making in the semiconductor sector.

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Life cycle assessment of DRAM in Taiwan's semiconductor industry

Cited by 39 publications

References 15 publications

Life cycle assessment of integrated circuit packaging technologies

Life cycle assessment of integrated circuit packaging technologies

Weighting and valuation in selected environmental systems analysis tools – suggestions for further developments

Developing a parametric carbon footprinting tool for the semiconductor industry

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