“…5 Diffusion bonding entailed applying a thin film of LiF on the mating surfaces of the pieces being joined and maintaining a constant compressive stress for >3 h at 550-575 • C. Without any interlayer, diffusion bonding was accomplished by applying constant pressure at 800-830 • C for about 6 h 4 . Limitations of this process are two-fold: (a) long hold times at elevated temperatures which can result in grain growth and (b) use of an extraneous interface material.…”