2007
DOI: 10.1109/jmems.2007.896705
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LF55GN Photosensitive Flexopolymer: A New Material for Ultrathick and High-Aspect-Ratio MEMS Fabrication

Abstract: A growing interest in the development of thick functional structures with high aspect ratio for microelectromechanical system (MEMS) applications has triggered the investigation of several polymer materials. This paper presents LF55GN flexopolymer material as a new negative-tone photoresist to fabricate ultrathick MEMS microstructures. Up to 4-mm-thick layers are obtained using a casting method in a single photolithography step. Standard UV illumination is used to polymerize such thick microstructures in less … Show more

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Cited by 6 publications
(8 citation statements)
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“…The advantages of micromolding include the reusable mold and bench-top fabrication. The use of spin-cast micromolding (SCμM) is simpler and easier to implement than RIE etching or laser (Garra et al 2002;Graubner et al 2002;Sayah et al 2007;Sia and Whitesides 2003). Spincasting techniques are also gentle in the sense that no high-energy ablation mechanism or harsh chemicals are required, which can be a concern when dealing with polymers and very thin-film metals.…”
Section: Electrode Designmentioning
confidence: 99%
See 1 more Smart Citation
“…The advantages of micromolding include the reusable mold and bench-top fabrication. The use of spin-cast micromolding (SCμM) is simpler and easier to implement than RIE etching or laser (Garra et al 2002;Graubner et al 2002;Sayah et al 2007;Sia and Whitesides 2003). Spincasting techniques are also gentle in the sense that no high-energy ablation mechanism or harsh chemicals are required, which can be a concern when dealing with polymers and very thin-film metals.…”
Section: Electrode Designmentioning
confidence: 99%
“…Additionally, gold does not form a surface oxide, making it suitable for electrode recording sites (Cogan 2008). PDMS shape and topography can be controlled by several methods, including photosensitive polymerization, laser ablation, reactive ion etching (RIE), and micromolding (Garra et al 2002;Graubner et al 2002;Sayah et al 2007;Sia and Whitesides 2003).…”
Section: Introductionmentioning
confidence: 99%
“…The incident angle of the collimated UV light in air is determined from the tilting angle of the photoresist container with LF55GN, which is controlled by the stepper motor and the computer controller. 11 It is very low compared to the absorption coefficient of SU8, which is 31 cm −1 at the same wavelength. 3.…”
Section: Photolithography Characterization Formentioning
confidence: 91%
“…11,12 Especially, the fabrication process for the polyurethane photoresist does not require softbake and postexposure bake steps. 11,12 Especially, the fabrication process for the polyurethane photoresist does not require softbake and postexposure bake steps.…”
Section: Introductionmentioning
confidence: 99%
“…The fabrication process consists of two steps: mask preparation and powderblasting machining: (a) LF55GN photosensitive elastomer (Macdermid, Cernay, France) is used as a masking material. More details of processing the photosensitive material can be found in previous work [30]. The elastomer presents a good erosion resistance to powder blasting [28].…”
Section: Methodsmentioning
confidence: 99%