2018
DOI: 10.1109/access.2018.2845861
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Leveraging Power-Performance Relationship of Energy-Efficient Modern DRAM Devices

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Cited by 21 publications
(16 citation statements)
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“…As discussed in the Section IV, the memory subsystem of the processing system consumes most of the power of the SoC chip compared to other components of the chip. The total power can be significantly reduced by utilizing Low Power DDR2 (LPDDR2) SDRAM with associated controllers instead of the DDR3 memory system since numerous optimization techniques are employed in the LPDDR2 to achieve lower power [72], [73].…”
Section: Discussionmentioning
confidence: 99%
“…As discussed in the Section IV, the memory subsystem of the processing system consumes most of the power of the SoC chip compared to other components of the chip. The total power can be significantly reduced by utilizing Low Power DDR2 (LPDDR2) SDRAM with associated controllers instead of the DDR3 memory system since numerous optimization techniques are employed in the LPDDR2 to achieve lower power [72], [73].…”
Section: Discussionmentioning
confidence: 99%
“…The power model includes the core active, wait-for-memory (WFM) and static core energy, LLC read/write and static cache energy. For the memory power models, we use the DRAM power values as reported in [42]. Furthermore, counters in gem5-X statistics like active CPU cycles, WFM cycles, cache read and writes hits and main memory accesses are used for power modeling.…”
Section: Power Modelsmentioning
confidence: 99%
“…In our PDS analysis model, we use a simple lumped RLC T-model because the capacitance and inductance of the RDL are relatively small in the overall system (see Figure 5). 2 The T-model is electrically bi-directional, which is closer to the realistic PDN model and has higher accuracy than the RLC model in AC analysis [19]. The RDL model is connected to the memory package wire and the on-chip pad model that consists of a lumped resistor and a capacitor.…”
Section: On-chip Modeling 1) On-chip Redistribution Layermentioning
confidence: 99%
“…However, although target performances have been met, certain undesirable effects, such as mismatch and crosstalk, have also occurred in systems. In addition, physical limitations reveal low power efficiency with increasing input/output (I/O) bandwidth between the central processing unit and memory [2]. Therefore, we need to maximize the performance of the electrical links in a printed circuit board (PCB) and the package structure in highspeed signal transmission conditions.…”
Section: Introductionmentioning
confidence: 99%