1973
DOI: 10.1115/1.3450019
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Leidenfrost Temperature—Its Correlation for Liquid Metals, Cryogens, Hydrocarbons, and Water

Abstract: A prediction technique for the Leidenfrost and minimum temperatures is presented which considers the effects of the critical temperature of the liquid, thermal properties of the solid, surface energy of the liquid, and surface energy of the solid. The prediction technique is in good agreement with data for liquid metals, cryogens, hydrocarbons, and water.

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Cited by 242 publications
(97 citation statements)
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“…Next to the impact velocity U, a key process that significantly affects T L is the cooling of the substrate due to its exposure to the cold liquid. T L thus strongly depends on the thermophysical properties of both the liquid and the substrate used [12,25,26]. For example, a gently deposited ethanol droplet can achieve the Leidenfrost state at T L;static ¼ 157°C on polished aluminum, whereas on pyrex glass a temperature as high as 360°C is required.…”
mentioning
confidence: 99%
“…Next to the impact velocity U, a key process that significantly affects T L is the cooling of the substrate due to its exposure to the cold liquid. T L thus strongly depends on the thermophysical properties of both the liquid and the substrate used [12,25,26]. For example, a gently deposited ethanol droplet can achieve the Leidenfrost state at T L;static ¼ 157°C on polished aluminum, whereas on pyrex glass a temperature as high as 360°C is required.…”
mentioning
confidence: 99%
“…Baumeister and Simon (1973) added an empirical factor to equation (3) which accounts for the effect of surface cooling caused by the impingement of a cold droplet:…”
Section: Discussionmentioning
confidence: 99%
“…In some cases, the wall temperature can locally vary significantly [10,11]. The only unknown left in Equation 1.1 is the pressure field, through which the dynamics of the film interface is coupled with the dynamics inside the liquid phase.…”
Section: General Description 121 the Modelling Of Thin Vapour Filmsmentioning
confidence: 99%
“…Therefore we compare this boundary with T L for different pressures on a silicon substrate. Because of its high thermal conductivity k s = 148 W/(m K) at T = 300K , the silicon substrate is considered to be isothermal [10] during the evaporation of the drop. The pressure dependence of T L = T L (P ) is shown in Fig.…”
Section: Boundary Between the Contact And Transition Boiling Regimementioning
confidence: 99%
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