Lead-free solder materials: experimental enthalpies of mixing in the Ag–Cu–Sn and Cu–Ni–Sn ternary systems

Luef, Christoph; Flandorfer, Hans; Ipser, Herbert

doi:10.3139/146.017929

Cited by 26 publications

(19 citation statements)

References 4 publications

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“…The moreor-less constant values for h Pd for concentrations up to approximately 30 at. pct Pd in Figure 4 can be explained by the concept of the Fermi enthalpy established by Hayer et al [21,22] In our preceding articles, [11][12][13][14] we concluded that the precision of our drop calorimetric measurements is generally Ϯ150 J mol Ϫ1 .…”

Section: A Experimental Resultsmentioning

confidence: 91%

“…Enthalpies of mixing for the five other binary systems relevant to the present investigation (Ag-Pd, [11] Ag-Sn, [12,13] InPd, [14] In-Sn, [14] and Pd-Sn [14] ) have recently been (re)measured and assessed in our group.…”

Section: A the Binary Systemsmentioning

confidence: 99%

“…are the so-called binary interaction parameters of the order . In this case, it was necessary to use three parameters, L (0) , L (1) , and L (2) , for a good description, so the polynomial has the form [3] The results of the least-squares fit for Ag-In are presented in Table II together with the literature values for the binary interaction parameters of Ag-Pd, Ag-Sn, In-Pd, In-Sn, and Pd-Sn, which have recently been determined by Luef et al [11][12][13][14] In a second step, the ternary Ag-In-Pd experimental data by Hayer [15] and the combined Ag-In-Sn data from Gather et al, [16] Alaoui-Elbelghiti, [17] and this work were treated by a least-squares fit. In this case, the so-called RedlichKister-Muggiano polynomial was used, which also takes the additional ternary interactions into account: [23] [4] where i and j are equal to 1, 2, or 3 for the elements Ag, In, and Pd, or Ag, In, and Sn, respectively, and L i:j (n) (n ϭ 0,1,2, .…”

Section: B Binary and Ternary Modelingmentioning

confidence: 99%

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Lead-free solder materials: Experimental enthalpies of mixing of liquid Ag-In-Pd-Sn alloys

Luef

Flandoreer

Ipser

2005

Metall Mater Trans A

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The partial and integral enthalpies of mixing of liquid Ag-In-Sn and Ag-In-Pd-Sn alloys were determined at 900 °C by a drop calorimetric technique using a Calvet-type microcalorimeter. The binary interaction parameters of Ag-In and the ternary interaction parameters of Ag-In-Pd and Ag-In-Sn were fitted based on both literature data and the authors' measurements employing the Redlich-Kister-Muggiano model for substitutional solutions. Furthermore, it was investigated whether additional quaternary interactions have to be taken into account for the description of the enthalpy of mixing in the Ag-In-Pd-Sn system.

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Section: A Experimental Resultsmentioning

confidence: 91%

Section: A the Binary Systemsmentioning

confidence: 99%

Section: B Binary and Ternary Modelingmentioning

confidence: 99%

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Lead-free solder materials: Experimental enthalpies of mixing of liquid Ag-In-Pd-Sn alloys

Luef

Flandoreer

Ipser

2005

Metall Mater Trans A

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“…The result of the least squares fit for Ag-Pd is presented in Table 3 together with the literature values for the binary interaction parameters of Ag-Sn [9,12] and Pd-Sn [10]. The calculated curve of the enthalpy of mixing versus molar fraction is also included in Fig.…”

Section: Binary and Ternary Modellingmentioning

confidence: 99%

Enthalpies of mixing of metallic systems relevant for lead-free soldering: Ag–Pd and Ag–Pd–Sn

Luef

Paul

Flandorfer

et al. 2005

Journal of Alloys and Compounds

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“…The viscosities, densities and atomic weights of the pure components Ag, Cu and Sn metals are shown in Table 2. For our calculation we used the data of Luef et al 35 for the Ag-Sn, Ag-Cu and Cu-Sn systems (Table 3).…”

Section: Kaptay's Equationmentioning

confidence: 99%

Theoretical investigation of some physicochemical properties in the liquid Sn–Ag–Cu alloys

M’chaar

Sabbar

Moudane

et al. 2017

J. Theor. Comput. Chem.

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Some physicochemical properties such as surface tension, molar volume, density and viscosity of liquid Sn-Ag-Cu alloys have been calculated using Kohler, Muggianu, Toop and Hillert geometrical models along three cross-sections namely x Ag /x Cu ¼ 1=2, 1/1 and 2/1. Indeed, Guggenheim, Kozlov-Romanov-Petrov and Kaptay equations have also been extended to estimate the surface tension and viscosity based on the thermodynamic data of the investigated system over wide temperature ranges of 823-1123 K and 773-1173 K, respectively. The results show that the three investigated properties, surface tension, density and viscosity, decrease with increasing tin for all studied models. On the other hand, a di®erent behavior of these properties as a function of the temperature was noted. This evolution depends on the composition of the studied alloys.On the contrary, the molar volume increases with increase of temperature and tin compositions. It should be noted that the surface tension, density and molar volume show a linear dependence on temperature for all the investigated compositions. For viscosity, a curvilinear dependence has been observed. The calculated surface tensions and densities were compared with those reported experimentally for Sn-Ag-Cu alloys along the cross-section x Ag /x Cu ¼ 1/1.

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Lead-free solder materials: experimental enthalpies of mixing in the Ag–Cu–Sn and Cu–Ni–Sn ternary systems

Cited by 26 publications

References 4 publications

Lead-free solder materials: Experimental enthalpies of mixing of liquid Ag-In-Pd-Sn alloys

Lead-free solder materials: Experimental enthalpies of mixing of liquid Ag-In-Pd-Sn alloys

Enthalpies of mixing of metallic systems relevant for lead-free soldering: Ag–Pd and Ag–Pd–Sn

Theoretical investigation of some physicochemical properties in the liquid Sn–Ag–Cu alloys

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