Lead-free 0201 manufacturing, assembly and reliability test results

Ramkumar, S. Manian; Ghaffarian, Reza; Varanasi, Arun

doi:10.1016/j.microrel.2005.09.007

Cited by 17 publications

(12 citation statements)

References 7 publications

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“…Hui and Ralph [2] [9], [11], [12]. Ramkumar et al [9] evaluated the tombstoning performance of 0201 caps for four pad designs, two pad layouts, five pad surface finishes, three solder alloys, and two different soldering stencil thicknesses. This extensive experiment showed that for all the cases, the defect rate was not correlated with the orientation of the capacitor going into the oven (see Fig.…”

Section: Past Theory and Experimentsmentioning

confidence: 99%

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Tombstone Initiation Model for Small Form-Factor Surface Mount Passives

Raravikar

Panat

Jadhav

2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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Passive components such as capacitors are shrinking in size in electrical systems in tandem with the device transistor features. With the size shrink comes an increased risk of process-induced defects such as capacitor tombstoning or billboarding. These defects involve poor connectivity of capacitor terminations to the substrates, affecting the electrical performance of the system. We have developed an analytical model to predict the probability of such defects to occur as a function of the design and process factors. The model demonstrates that the surface tension at component terminals dominates over the inertia forces (component weight) in case of components with submilligram weight. Bulkier capacitors have lower risk of tombstoning compared to the lighter ones. The analysis also points to other modulating factors such as component termination width, component height, solder pad size, and the solder paste volume. We also present the experimental results on small formfactor components that confirm some of the predictions for the model. Optimum design guidelines for the electrical systems with soldered components can be obtained from the current model.

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Section: Past Theory and Experimentsmentioning

confidence: 99%

“…For example, any difference in the wetting speed of the solder at two passive terminals will give rise to different contact angles resulting in tombstoning, simply due to the very low weight of the small FF caps. To give some idea, the mass of a 0201 capacitor (0.32 mg) [9] is around 30× less than that for a 0603 capacitor (10 mg) [10].…”

mentioning

confidence: 99%

Tombstone Initiation Model for Small Form-Factor Surface Mount Passives

Raravikar

Panat

Jadhav

2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…SAC305 [10]) as well as component finishes consisting of pure tin [11,12]. The coating of connector finishes and component leads with pure tin is similar to the tin-lead process, thus the implementation of a completely new procedure was not necessary [13,14]. Additional advantages of tin are its good solderability and its readily economical use.…”

Section: Introductionmentioning

confidence: 99%

The surface energies of β-Sn — A new concept for corrosion and whisker mitigation

Eckold

Sellers

Niewa

et al. 2015

Microelectronics Reliability

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Corrosion data provided under high-temperature and high-humidity conditions as well as tin whisker growth studies are explained by differences in the surface energy of lattice planes within the crystal structure of β-tin. For this purpose, electrodeposited tin finishes were investigated regarding their microstructure utilizing X-ray diffraction, cross-sectional SEM and EBSD analysis. The corrosion as well as the tin whisker propensity strongly depends on the preferred orientation of the surface finishes. With an increasing texture along the (211) lattice plane a decreasing corrosion and whisker propensity was observed, in contrary, the presence of the (101) and (112) textures results in an increased corrosion and whisker propensity. The maximum whisker length was reduced by one order of magnitude by changing the preferred orientation towards the (211) lattice plane of the tin finish. Modified embedded-atom method simulations of tin surfaces demonstrate the minimization of the surface energy of (211) surfaces, whereas the surface energies of the (101) and (112) Miller planes are increased. We find a strong connection between the minimization of surface energy and the corrosion and tin whisker propensity of electrodeposited tin finishes. To our best knowledge, this is the first study connecting the influence of the electrodeposition parameters on the corrosion and whisker propensity explained by calculations of the surface energies of

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“…The primary objective of this part of the experimental research, carried out in collaboration with the Rochester Institute of Technology (RIT), is to characterize isothermal aging followed by drop integrity of surface mount mixed (Sn 37 Pb and lead-free) assembly solder joints [11,[42][43][44][45][46][47][48][49]. The investigation involves both forward and backward compatibility.…”

Section: Introductionmentioning

confidence: 99%

Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies

Ghaffarian

2011

Structural Dynamics of Electronic and Photonic Systems

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SUMMARYCommercial off-the-shelf area array packaging (COTS AAP) technologies are considered for use in a number of high-reliability electronics systems. Understanding the process and quality assurance (QA) indicators for reliability, as well as developing methods to project life under thermal and mechanical environment, is important for the low-risk insertion of these newly available electronic packages. Extensive investigations were performed by NASA in collaboration with industry and universities to address key manufacturing and reliability issues on the continuously evolving AAP technology. The reliability results based on test data will facilitate use of various low-pitch and high-input/output (I/O) area array packages, with more processing power in a smaller board footprint. Topics discussed in this chapter are as follows:• Packaging technology trend for AAPs, including plastic ball grid array (PBGA), chipscale packages (CSPs), and 3D stack packages. • Summary of key parameters that affect assembly reliability of PBGAs and flip-chip BGA (FCBGA) based on a comprehensive literature search. The effect of a doublesided mirror image array package on solder joint reliability is also addressed. IPC 9701A specification was reviewed for lead-free solder alloy requirements. • Test results for a test vehicle having various packages including a PBGA with 1156 I/Os subjected to various thermal cycling. X-ray and scanning electron microscopy (SEM) and X-sections after thermal cycling. • Literature survey and test results for a COTS PBGA 676 I/O package assembly with various ball/solder alloys representing the current migration of industry to lead-free solders. A number of test vehicles, assembled and supplied by an engineering manufacturing service (EMS) company collaborator, were subjected to thermal cycling evaluation as part of collaboration activity. The test results are presented. • The test results for thermal cycling and vibration of numerous CSPs soldered with tin-lead and with and without underfill are presented. • Extensive vibration and thermal cycle data were generated by the consortium team members of the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP). Vibration test results for BGA 225 I/O package assemblies with tin-lead and lead-free solder were reviewed and compared with other models and 519

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Lead-free 0201 manufacturing, assembly and reliability test results

Cited by 17 publications

References 7 publications

Tombstone Initiation Model for Small Form-Factor Surface Mount Passives

Tombstone Initiation Model for Small Form-Factor Surface Mount Passives

The surface energies of β-Sn — A new concept for corrosion and whisker mitigation

Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies

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