2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 2022
DOI: 10.1109/itherm54085.2022.9899615
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Layered Unsupervised Learning-based Identification and Quantification of Voids in Package Thermal Interface Materials

Rahul Lall
1
,
Kamal Sikka
2
,
Isabel de Sousa3
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