Robust Image Processing Software for Void Calculation in Thermal Interface Materials

Song, Mei-Hui; Oh, Zi-Ying; Lee, Xi-Wen; Ng, Marcus; Zee, Bernice; Foo, Fang-Jie; Jiang, Ting-Ying

doi:10.1109/ipfa58228.2023.10249157

2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2023

DOI: 10.1109/ipfa58228.2023.10249157

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Robust Image Processing Software for Void Calculation in Thermal Interface Materials

Mei-Hui Song,

Zi-Ying Oh,

Xi-Wen Lee

et al.

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Robust Image Processing Software for Void Calculation in Thermal Interface Materials

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References 11 publications

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