Latest developments in the understanding of PVA brush related issues during post CMP (pCMP) cleaning

Yerriboina, Nagendra Prasad; Park, Jin-Goo

doi:10.1016/b978-0-12-821791-7.00004-6

Cited by 2 publications

(3 citation statements)

References 38 publications

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“…Their key characteristic is excellent water absorption and retention, ensuring steady solvent delivery to the wafer surface and enhancing residue removal. 78 The manufacturing of PVA brushes is a multistep process. 73 It begins with dissolving hydrolyzed poly(vinyl alcohol) in water under sustained heat (85−90 °C) and stirring.…”

Section: Cmp Padsmentioning

confidence: 99%

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Environmental Impact Assessment of Chemical Mechanical Planarization Consumables: Challenges, Future Needs, and Perspectives

Venkataswamy,

Trimble,

McDonald

et al. 2024

ACS Sustainable Chem. Eng.

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This paper provides a detailed overview of the environmental impacts and sustainability of chemical mechanical planarization (CMP) consumable manufacturing in the semiconductor industry, especially in the context of rising global demand for semiconductors. It addresses the significant environmental challenges faced by the industry, particularly in terms of energy, water, and material consumption. A thorough examination of the manufacturing processes for key CMP consumables, such as slurries, pads, brushes, cleaning solutions, and conditioners, is discussed. The environmental impact of each process highlights the considerable role CMP consumables play in the industry's overall environmental footprint. The production of CMP slurries and pads is particularly energy-and water-intensive, uses hazardous materials, and significantly contributes to greenhouse gas emissions and resource depletion. While the environmental impacts of PVA brushes, cleaning solutions, and conditioners are relatively minor, their production still requires careful consideration. In response to these challenges, this paper proposes a vision for future CMP sustainability analysis, emphasizing a collaborative approach among chipmakers, consumable manufacturers, and academic institutions to enable the understanding of the environmental impacts of different materials used in consumable manufacturing and assist in the selection of environmentally friendly options. We highlight an urgent need for the CMP community to adopt comprehensive sustainability practices with a particular focus on consumable manufacturing.

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Section: Cmp Padsmentioning

confidence: 99%

“…Polyvinyl acetal (PVA) brushes are designed for the effective removal of particles and contaminants from wafer surfaces. Their key characteristic is excellent water absorption and retention, ensuring steady solvent delivery to the wafer surface and enhancing residue removal …”

Section: Manufacturing Process Of Cmp Consumables and Their Possible ...mentioning

confidence: 99%

Environmental Impact Assessment of Chemical Mechanical Planarization Consumables: Challenges, Future Needs, and Perspectives

Venkataswamy,

Trimble,

McDonald

et al. 2024

ACS Sustainable Chem. Eng.

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“…13 Thus, well-designed post-polish CMP cleaning has become a crucial step to eliminate many of these defects. 50 Organic compounds such as stabilizers, dispersants, complexing agents, passivation agents, etc., are added to most commercial ceriabased CMP slurries to achieve long-term stability and the required CMP performance. Chemical adsorption of these organic additives at the ceria surface occurs through the contributions of electrostatic, H-bonding, and van der Waals interactions.…”

Section: Future Research Needs and Prospectsmentioning

confidence: 99%

Perspective—Recent Advances and Thoughts on Ceria Particle Applications in Chemical Mechanical Planarization

Seo

Kim

Kang

et al. 2022

ECS J. Solid State Sci. Technol.

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Along with the remarkable growth in the complexity of semiconductor fabrication technology, chemical mechanical planarization (CMP) has evolved and become progressively more sophisticated over the years, enabling the implementation of novel integration schemes. This paper discusses current research and development trends in one specific aspect of the CMP technology, namely, ceria particle usage for advanced technology nodes and provides some perspectives on how to improve CMP performance metrics of the current ceria abrasives and ceria-based CMP slurries and move forward to the next phase.

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Latest developments in the understanding of PVA brush related issues during post CMP (pCMP) cleaning

Cited by 2 publications

References 38 publications

Environmental Impact Assessment of Chemical Mechanical Planarization Consumables: Challenges, Future Needs, and Perspectives

Environmental Impact Assessment of Chemical Mechanical Planarization Consumables: Challenges, Future Needs, and Perspectives

Perspective—Recent Advances and Thoughts on Ceria Particle Applications in Chemical Mechanical Planarization

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