Laser Processing of Coarse Grain Polycrystalline Diamond (PCD) Cutting Tool Inserts using Picosecond Laser Pulses

Characterisation of thermal influences after laser processing polycrystalline diamond composites using long to ultrashort pulse durations

“…As a result, there is no residual or measurable graphitic carbon at the laser processed region using picosecond pulses. Conversely, there does exist a minimal presence of porosity which is presumably residual porosity due to the wire EDM process or due to the relatively high fluence used since according to Dold et al [31], a fluence of only 5.53 J/cm 2 is necessary to process coarse grain PCD composite cutting tools. This region is defined as a HAZ exhibiting a thickness of less than 350 nm.…”

Laser fabrication of diamond micro-cutting tool-related geometries using a high-numerical aperture micro-scanning system

“…However, post-processing is necessary when using nanosecond pulse durations to achieve the quality required by industry. For this reason, Dold et al [6] used a τ p =10 ps, λ=1064 nm laser and optimised the laser ablation process for PCD composite cutting inserts. The laser processed inserts exhibited no grain breakouts and faster processing times.…”

Ablation Study of WC and PCD Composites Using 10 Picosecond and 1 Nanosecond Pulse Durations at Green and Infrared Wavelengths

“…As a result, the recent use of ultrashort picosecond laser technology to process PCD composites and WC is demonstrated by Dold et al (2012 and2013) using a τp = 10 ps, λ = 1064 nm, Ep = 50 μJ laser system. Laser processing is faster than conventional grinding methods, no grain breakouts occurs and no thermal effects are observed.…”