Ablation Study of WC and PCD Composites Using 10 Picosecond and 1 Nanosecond Pulse Durations at Green and Infrared Wavelengths

Eberle, Gregory; Wegener, Konrad

doi:10.1016/j.phpro.2014.08.115

Cited by 34 publications

(10 citation statements)

References 14 publications

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“…A graphite layer is found to exist beneath the ablated top surface. Nonetheless, under ultra-short pulsed laser ablation, the graphitization process is more obscure, depending on the pulse length or fluence according to different papers [18][19][20] . The potential allotropic transformation of the diamond structure after laser ablation is a critical aspect for the development of a laser polishing process.…”

Section: Interaction With Pcd Composition and Structurementioning

confidence: 99%

Development of high power laser ablation process for polycrystalline diamond polishing: Part 1. Fundamental understanding of PCD ultra-short pulsed laser ablation

Scalbert

Tanner

Laffir

et al. 2018

High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VII

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Diamond exhibits incredible chemical and mechanical properties. Utilization of diamond for industrial applications has universally spread thanks to the discovery of its industrial synthesis and the enhancement of its properties by its formation under a polycrystalline form, named polycrystalline diamond composite (PCD). For industrial production PCD bulk material has to pass through several complex processes from leaving the belt press down to be polished as a wafer with a mirror-finished surface. Especially the polishing process is an extremely laborious method originally discovered to polish diamond gemstones hundred years ago 1. Laser ablation has repeatedly been proven to be a cost efficient process for industrial purposes. Elaboration of new ablation processes for PCD manufacturing is increasing supported by the continuous improvement of ultra-short lasers and their high performances 2. The ambition of this project is to develop an alternative polishing process of PCD wafers by ultra-short laser ablation achieving better performances than traditional mechanical polishing. This paper presents a relationship between material related properties of various PCD grades and performance of ultra-short laser ablation process at low laser average power. Specifically, this paper demonstrates the high impact of the pulse duration on the ablation rate, the dependence of the optimal fluence for highest ablation rate on the PCD composition and the effect of fluence on diamond graphitization through Raman spectroscopy analysis.

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Section: Interaction With Pcd Composition and Structurementioning

confidence: 99%

Development of high power laser ablation process for polycrystalline diamond polishing: Part 1. Fundamental understanding of PCD ultra-short pulsed laser ablation

Scalbert

Tanner

Laffir

et al. 2018

High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VII

View full text Add to dashboard Cite

show abstract

“…The advantages of this are higher ablation rates with better precision. Eberle et al [ 59 ] ablated PCD-Co10% and WC-Co4.6% at 2 distinct wavelengths: 532 nm and 1064 nm. The ablation rate was consistently higher at different fluences and pulse durations when the 532 nm was used ( Figure 7 b,c).…”

Section: Fabrication Of Surface Texturesmentioning

confidence: 99%

“… ( a ) Overview of material behaviour at different wavelengths, ( b ) Ablation rate for PCD. ( c ) Ablation rate for WC [ 59 ] (copyright permission from Elsevier). …”

Section: Figurementioning

confidence: 99%

Laser Processing of Hard and Ultra-Hard Materials for Micro-Machining and Surface Engineering Applications

2021

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Polycrystalline diamonds, polycrystalline cubic boron nitrides and tungsten carbides are considered difficult to process due to their superior mechanical (hardness, toughness) and wear properties. This paper aims to review the recent progress in the use of lasers to texture hard and ultra-hard materials to a high and reproducible quality. The effect of wavelength, beam type, pulse duration, fluence, and scanning speed is extensively reviewed, and the resulting laser mechanisms, induced damage, surface integrity, and existing challenges discussed. The cutting performance of different textures in real applications is examined, and the key influence of texture size, texture geometry, area ratio, area density, orientation, and solid lubricants is highlighted. Pulsed laser ablation (PLA) is an established method for surface texturing. Defects include melt debris, unwanted allotropic phase transitions, recast layer, porosity, and cracking, leading to non-uniform mechanical properties and surface roughness in fabricated textures. An evaluation of the main laser parameters indicates that shorter pulse durations (ns—fs), fluences greater than the ablation threshold, and optimised multi-pass scanning speeds can deliver sufficient energy to create textures to the required depth and profile with minimal defects. Surface texturing improves the tribological performance of cutting tools in dry conditions, reducing coefficient of friction (COF), cutting forces, wear, machining temperature, and adhesion. It is evident that cutting conditions (feed speed, workpiece material) have a primary role in the performance of textured tools. The identified gaps in laser surface texturing and texture performance are detailed to provide future trends and research directions in the field.

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“…The chip breaker was manufactured using a nano-second laser, the ablation process was performed with a SPI-G4-HS ns ytterbium-doped fiber laser, Hedge End, Southampton, United Kingdom, emitting pulses at a wavelength of 1064 nm and using a mean power value of around 40 W. It has been reported that the ablation of PCD using ns pulses takes place via graphitization of the diamond in the PCD which is transformed into graphitic carbon [41]. The proportionality between the graphite-layer thickness, the pulse duration and the laser fluence has been proven [42].…”

Section: Manufacturing Of the Chip Breakermentioning

confidence: 99%

Tailored Chip Breaker Development for Polycrystalline Diamond Inserts: FEM-Based Design and Validation

2019

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Chip evacuation is a critical issue in metal cutting, especially continuous chips that are generated during the machining of ductile materials. The improper evacuation of these kinds of chips can cause scratching of the machined surface of the workpiece and worsen the resultant surface quality. This scenario can be avoided by using a properly designed chip breaker. Despite their relevance, chip breakers are not in wide-spread use in polycrystalline diamond (PCD) cutting tools. This paper presents a systematic methodology to design chip breakers for PCD turning inserts through finite element modelling. The goal is to evacuate the formed chips from the cutting zone controllably and thus, maintain surface quality. Particularly, different scenarios of the chip formation process and chip curling/evacuation were simulated for different tool designs. Then, the chip breaker was produced by laser ablation. Finally, experimental validation tests were conducted to confirm the ability of this chip breaker to evacuate the chips effectively. The machining results revealed superior performance of the insert with chip breaker in terms of the ability to produce curly chips and high surface quality (Ra = 0.51–0.56 µm) when compared with the insert without chip breaker that produced continuous chips and higher surface roughness (Ra = 0.74–1.61 µm).

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Ablation Study of WC and PCD Composites Using 10 Picosecond and 1 Nanosecond Pulse Durations at Green and Infrared Wavelengths

Cited by 34 publications

References 14 publications

Development of high power laser ablation process for polycrystalline diamond polishing: Part 1. Fundamental understanding of PCD ultra-short pulsed laser ablation

Development of high power laser ablation process for polycrystalline diamond polishing: Part 1. Fundamental understanding of PCD ultra-short pulsed laser ablation

Laser Processing of Hard and Ultra-Hard Materials for Micro-Machining and Surface Engineering Applications

Tailored Chip Breaker Development for Polycrystalline Diamond Inserts: FEM-Based Design and Validation

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