2004
DOI: 10.1016/j.susc.2004.02.039
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Laser patterning of metallic films via buffer layer

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Cited by 21 publications
(36 citation statements)
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“…The details of the experimental setup were described elsewhere [7,8,10]. The method is schematically shown in Fig.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The details of the experimental setup were described elsewhere [7,8,10]. The method is schematically shown in Fig.…”
Section: Resultsmentioning
confidence: 99%
“…It is therefore possible to utilize laser ablation of weakly adsorbed buffer layers for the removal and patterning of metallic film deposited on top. This overcomes LITD limitations, and has enabled the patterning of metallic films and clusters on surfaces [7][8][9], and the in situ investigation of clusters surface diffusion [10]. Patterning Xe in the form of monolayer grating as a template for hydrogen sticking to silicon was reported earlier by Williams et al [11].…”
Section: Introductionmentioning
confidence: 83%
“…Mainly two techniques have been developed to turn off the substrate's influence during growth: the soft-landing of gas-phase clusters [13] and the buffer-layer-assisted cluster growth (BLAG) directly at the surface [61][62][63]. Both techniques are, in principle, suitable to form clusters of almost any material on any substrate [64,65], without the implications associated with epitaxy. The clusters are formed before they make contact with the substrate and their initial structure is not impeded by the surface [66].…”
Section: Cluster Depositionmentioning
confidence: 99%
“…13 and 14͒ directly on template surfaces. Since BLAG permits, in principle, the deposition of any material on any substrate, 15,16 our approach has the potential to be applicable to many other metallic or nonmetallic materials.…”
Section: Introductionmentioning
confidence: 99%