Abstract:Abstract:Responses of two types of single-crystal diamonds, prepared by chemical vapour deposition (CVD) and high pressure high temperature synthesis (HPHT) methods, respectively, to a nanosecond pulsed neodymium-doped yttrium aluminium garnet (Nd:YAG) laser were investigated and compared. It was found that due to the difference in the transmission rate and refractive index, the laser-induced surface/subsurface features of the two types of samples were distinctly different. For the CVD sample, destructive inte… Show more
“…When the liner polarized laser beam was used by changing the optical setup, the generating direction of these periodic surface structures was still in parallel direction to laser scanning line regardless of polarization plane, and it appeared only after the generation of groove with a certain depth. Thus, these phenomena were caused by reflection of laser beam on the wall of groove, as reported by using nanosecond pulsed laser [7]. On the other hand, unique processing phenomenon could be observed only at 500 shots and 1000 shots.…”
Section: Influence Of Shot Number On Surface Appearancementioning
confidence: 74%
“…Although diamond has high optical transparency for a laser beam, stable absorption of laser energy can be achieved by high peak power of pulsed operation, which ignites multi-photon ionization and absorption of laser beam at defects in diamond. Diamond is usually removed by the combination of ablation phenomena, graphitization and oxidization [7]. However, graphited or carbide layers remain as heat affected zone after removal process by nanosecond pulsed lasers [8,9].…”
In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than Ra = 0.2 µm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.Laser beam machining (LBM); Laser micro machining; Diamond
“…When the liner polarized laser beam was used by changing the optical setup, the generating direction of these periodic surface structures was still in parallel direction to laser scanning line regardless of polarization plane, and it appeared only after the generation of groove with a certain depth. Thus, these phenomena were caused by reflection of laser beam on the wall of groove, as reported by using nanosecond pulsed laser [7]. On the other hand, unique processing phenomenon could be observed only at 500 shots and 1000 shots.…”
Section: Influence Of Shot Number On Surface Appearancementioning
confidence: 74%
“…Although diamond has high optical transparency for a laser beam, stable absorption of laser energy can be achieved by high peak power of pulsed operation, which ignites multi-photon ionization and absorption of laser beam at defects in diamond. Diamond is usually removed by the combination of ablation phenomena, graphitization and oxidization [7]. However, graphited or carbide layers remain as heat affected zone after removal process by nanosecond pulsed lasers [8,9].…”
In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than Ra = 0.2 µm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.Laser beam machining (LBM); Laser micro machining; Diamond
“…Over the recent years, numerous lasers have been used for diamond processing, including pulsed excimer [136], Nd-YAG [137], XeCl [138], and ArF [139] lasers. Short-pulse lasers are especially effective in achieving high-precision and sharp profiles while minimizing heat conduction into the bulk material [140]. Femtosecond pulses and an accelerating beam can be used to achieve curved profiles with micron-sized curvatures.…”
Section: Materials Removal Mechanism Of Lapmentioning
Diamond is a highly valuable material with diverse industrial applications, particularly in the fields of semiconductor, optics, and high-power electronics. However, its high hardness and chemical stability make it difficult to realize high-efficiency and ultra-low damage machining of diamond. To address these challenges, several polishing methods have been developed for both single crystal diamond (SCD) and polycrystalline diamond (PCD), including mechanical, chemical, laser, and ion beam processing methods. In this review, the characteristics and application scope of various polishing technologies for SCD and PCD are highlighted. Specifically, various energy beam-based direct and assisted polishing technologies, such as laser polishing, ion beam polishing, plasma-assisted polishing, and laser-assisted polishing, are summarized. The current research progress, material removal mechanism, and influencing factors of each polishing technology are analyzed. Although some of these methods can achieve high material removal rates or reduce surface roughness, no single method can meet all the requirements. Finally, the future development prospects and application directions of different polishing technologies are presented.
“…The removal process of monocrystalline diamond by the nanosecond pulsed laser was also discussed, and some researchers reported that there was smooth surface at the bottom of V-shaped micro-grooves [10,11]. However, the smooth area is limited to the tip of the micro-groove, and a flat surface could not be obtained for a wide area.…”
The flat plane of small surface roughness below 0.1 µm average roughness could be obtained for monocrystalline diamond by nanosecond pulsed laser irradiation of 1060 nm and post-process of acid cleaning, at the laser fluence around the threshold value of material removal. The glossy and flat plane at the bottom of micro-groove was parallel to the top surface of specimen, although the round beam of Gaussian-mode was irradiated in the direction perpendicular to the top surface of specimen. The square beam of top-hat mode could obtain shallower micro-groove with wide flat bottom in comparison with the round beam of Gaussian mode, and then the creation method of flat plane with small surface roughness was discussed in the arrangement strategy of linear micro-grooving by the square beam of top-hat mode. Normal side-by-side repetition of linear micro-grooving could not create the flat plane of a constant depth. Therefore, two-step scanning method was proposed in order to overcome the problem in the normal side-by-side repetition of liner micro-grooving. Non-removal areas were partly retained between the processing lines in the first step, and the laser scanning was conducted on the retained area in the second step. Newly proposed two-step scanning method was practical and useful to create a wide flat plane with small surface roughness, and the controllability of micro-groove depth could be improved by the two-step scanning method. This proposed method can reduce the surface roughness in addition to the shape creation of monocrystalline diamond, and it can be used as the high-quality micro-shape fabrication method of monocrystalline diamond.
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