Abstract:In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than Ra = 0.2 µm. New laser micro machining method to keep diamond structure and small surface rou… Show more
“…Monocrystalline diamonds were studied for micro-machining using a picosecond pulsed laser. 15 The results revealed that the cracks propagated in a direction parallel to the top surface of the workpiece. The researchers suggested a method that can be utilized for low-cost polishing of diamond surfaces using laser micro-machining.…”
Laser processing of materials finds application in micro-nano devices mainly because of its accuracy, flexibility, and ability to machine almost any material. Although it offers numerous advantages, it is a complex process involving a large number of factors. The quality of machining often depends on the appropriate selection of parameters. Moreover, the output responses in machining processes have conflicting nature; some are to be minimized, and others have to be maximized. This work uses grey relationship analysis coupled with principal component analysis for multi-response optimization of conflicting responses during laser machining of micro-channels. Micro-channels with a cross-sectional size of 200 × 100 µm were created using Nd:YAG laser beam micro-milling in steel alloy (AISI 1045). The scan speed, layer thickness, and scan strategy were found to have a significant effect on the dimensional accuracy of the microchannel. At the same time, the material removal rate was mostly influenced by layer thickness. Multi-response optimization results suggest low pulse frequency, high scan speed, low layer thickness, and S3 scan strategy for accurately fabricating micro-channels.
“…Monocrystalline diamonds were studied for micro-machining using a picosecond pulsed laser. 15 The results revealed that the cracks propagated in a direction parallel to the top surface of the workpiece. The researchers suggested a method that can be utilized for low-cost polishing of diamond surfaces using laser micro-machining.…”
Laser processing of materials finds application in micro-nano devices mainly because of its accuracy, flexibility, and ability to machine almost any material. Although it offers numerous advantages, it is a complex process involving a large number of factors. The quality of machining often depends on the appropriate selection of parameters. Moreover, the output responses in machining processes have conflicting nature; some are to be minimized, and others have to be maximized. This work uses grey relationship analysis coupled with principal component analysis for multi-response optimization of conflicting responses during laser machining of micro-channels. Micro-channels with a cross-sectional size of 200 × 100 µm were created using Nd:YAG laser beam micro-milling in steel alloy (AISI 1045). The scan speed, layer thickness, and scan strategy were found to have a significant effect on the dimensional accuracy of the microchannel. At the same time, the material removal rate was mostly influenced by layer thickness. Multi-response optimization results suggest low pulse frequency, high scan speed, low layer thickness, and S3 scan strategy for accurately fabricating micro-channels.
“…Under the action of femtosecond pulses, graphitization occurred layer by layer on the surface. Okamoto et al [21] studied the machining of monocrystalline diamond by picosecond laser (λ=1064nm, τ=12.5ps). acquiring the surface roughness less than 0.2μm.…”
As the hardest substance known in nature, diamond has plenty of excellent characteristics of good chemical stability, high thermal conductivity and high transmittance. Due to its unique physicochemical properties, diamond has shown great application value and prospects in the fields of solid-state power electronics, solid wave gyroscope, quantum communication, and high-precision tools, which make a strict request for the surface quality of diamonds. To this end, people have developed ultra-precision machining methods such as mechanical polishing, chemical mechanical polishing, laser polishing, and ultraviolet-irradiated precision polishing. However, owing to the unique lattice structure and ultra-high hardness of diamond, it is difficult to polish its surface roughness less than one nanometer by conventional methods . Therefore, modificating the physical and chemical properties of the diamond surface through the interaction of light and matter is an extremely promising method to reduce the processing difficulty and improve the fabrication accuracy. In recent years, with the continuous development of light source quality, laser polishing and ultraviolet catalytic polishing based on the interaction between light and diamond have received widespread attention. Laser polishing mainly takes advantage of the diamond graphitization under high-power laser irradiation to achieve the removal of diamond surface materials. While ultraviolet-irradiated precision polishing is based on the theory that ultraviolet light sources with the photon energy greater than bandwidth of diamond can induce photochemical reactions on the diamond surface to achieve diamond surface polishing. This paper introduces the main research progress in the field of diamond laser polishing and ultraviolet-irradiated precision polishing and compares the basic principles and processing devices of these two processing methods. Through the discussion of above problems, the characteristics of two processing methods are summarized, and the consideration on the optimization of diamond ultra-precision polishing methods is proposed accordingly, to further improve the processing accuracy of diamond ultra-precision polishing.
“…Laser polishing of diamond has been extensively studied by a variety of laser sources spanning from continuous to pulsed lasers with wide wavelengths ranging from infrared (IR) to ultraviolet (UV). [34,35] At the normal incidence, the minimum average roughness R a is 0.2 µm. [34,36] It is found that the laser incidence angle is a key factor which significantly affects the surface roughness.…”
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confidence: 99%
“…[34,35] At the normal incidence, the minimum average roughness R a is 0.2 µm. [34,36] It is found that the laser incidence angle is a key factor which significantly affects the surface roughness. An average roughness R a down to 0.15 µm over a scan length of 0.5 mm was achieved at an incidence angle of 77° with respect to the diamond surface normal.…”
It is a great technical challenge to precisely polish diamond substrates due to their extremely high hardness, especially for micro‐optics fabrication. Here, a simple laser polishing process is demonstrated for the optical quality surface finish of chemical vapor deposition diamond using a 355 nm nanosecond laser. Raman spectroscopy and surface profile analyses reveal that the laser polishing is an ablation‐based process that consists of laser graphitization and the subsequent laser ablation of the graphitized layer. An optimized strategy is proposed to realize the high‐quality polishing by combining the ablation effect and defocusing laser irradiation. The polishing strategy can effectively reduce the peak‐to‐valley height difference of a rough surface and automatically enables the laser fluence at a low level close to the ablation threshold. Laser polishing at such critical laser fluence can greatly avoid harmful effects caused by high laser fluence and achieve precision materials’ removal while maintaining optical surface quality. The approach is capable of delivering an average roughness Ra down to 8.02 nm and a high transmittance up to 80% of mechanically polished diamond in the visible spectrum. High optical performances make it possible to directly fabricate micro‐optical components on diamond substrates using this novel laser polishing approach.
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