Laser etching of fused silica using an adsorbed toluene layer

Zimmer, Klaus; Böhme, R.; Rauschenbach, B.

doi:10.1007/s00339-004-2961-y

Cited by 59 publications

(31 citation statements)

References 10 publications

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“…Furthermore, hybrid laser ablation methods based on the utilization of absorbing surface-adherent layers or media allow the use of cost-efficient nanosecond laser sources. These methods are known as laser-induced plasma-assisted ablation (LIPAA) [9,10], laser-induced backside wet etching (LIBWE) [11,12], laser etching at a surface adsorbed layer (LESAL) [13,14] and laser-induced backside dry etching (LIBDE) [15]. Recently, nanosecond laser ablation of optical glasses by introducing assisting atmospheric pressure plasmas to the ablation process was investigated.…”

Section: Introductionmentioning

confidence: 99%

Sequential Atmospheric Pressure Plasma-Assisted Laser Ablation of Photovoltaic Cover Glass for Improved Contour Accuracy

et al. 2014

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Abstract:In this paper, we present sequential atmospheric pressure plasma-assisted laser ablation of photovoltaic cover glass. First, glass samples were plasma pre-treated using a hydrogenous plasma process gas in order to accomplish a modification of the near-surface glass network by a chemical reduction and the implantation of hydrogen. As a result, the transmission at a wavelength of 355 nm was reduced by approximately 2% after plasma treatment duration of 60 min. Further, the surface polarity was increased by approximately 78%, indicating an increase of the near-surface index of refraction. Subsequently to the plasma pre-treatment, the samples were laser ablated applying the above-mentioned laser wavelength of a Nd:YAG nanosecond laser. Compared to untreated samples, a significant decrease of the form error by 45% without any mentionable change in the ablation rate was obtained in the case of pre-treated samples. For comparison, the results and findings are discussed with respect to previous work, where the presented plasma-assisted ablation procedure was applied to optical glasses.

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Section: Introductionmentioning

confidence: 99%

Sequential Atmospheric Pressure Plasma-Assisted Laser Ablation of Photovoltaic Cover Glass for Improved Contour Accuracy

et al. 2014

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“…We have recently present for the first time the inscription of relief, Bragg and long period gratings inside the hollow capillaries of microstructured optical fibres [2] using a variation of the laser induced backside wet etching (LIBWE) method [3], were the absorbing medium is toluene. The Bragg gratings were inscribed in commercial solid core PCFs and custom drawn grape-fruit type MOFs, using a standard phase mask setup in contact mode, while employing 248nm, nanosecond excimer laser radiation.…”

Section: Introductionmentioning

confidence: 99%

Laser etched gratings inside microstructured optical fibres

Konstantaki

Tsibidis

Childs

et al. 2013

MATEC Web of Conferences

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“…These methods employ an auxiliary medium which absorbs the UV laser photons and transfers some of the energy to the fused silica resulting in material removal. Some of these methods and variations thereof are known as laser-induced backside wet-etching (LIBWE) [6][7][8], laser-induced plasma assisted ablation (LIPAA) [9], laser etching at a surface adsorbed layer (LESAL) [10], and, more recently, laserinduced backside dry etching (LIBDE) [11]. LIBDE, which commonly uses metal absorbers, has been thoroughly studied [12,13] and is a promising technique for laser microprocessing of transparent materials.…”

Section: Introductionmentioning

confidence: 99%

Ablation of silicon suboxide thin layers

Jahn

Richter

Weichenhain-Schriever

et al. 2010

Appl. Phys. A

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We investigate the ablation of SiO x thin films on fused silica substrates using single-pulse exposures at 193 nm and 248 nm. Two ablation modes are considered: front side (the surface of a film is irradiated from above) and rear side (a film is irradiated through its supporting substrate). Fluence is varied from below 200 mJ/cm 2 to above 3 J/cm 2 . SiO x films of thickness 200 nm, 400 nm, and 600 nm are ablated. In the case of rear-side illumination, at moderate fluences (around 0.5 mJ/cm 2 ) the ablation depth corresponds roughly to the film thickness, above 1 J/cm 2 part of the substrate is ablated as well. In the case of frontside ablation the single-pulse ablation depth is limited for all film thicknesses to less than 200 nm even at fluences up to 4 J/cm 2 . Experimental results are discussed in relation to film thickness, fluence, and ablation mode. Simple numerical calculations are performed to clarify the influence of heat transport on the ablation process.

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Laser etching of fused silica using an adsorbed toluene layer

Cited by 59 publications

References 10 publications

Sequential Atmospheric Pressure Plasma-Assisted Laser Ablation of Photovoltaic Cover Glass for Improved Contour Accuracy

Sequential Atmospheric Pressure Plasma-Assisted Laser Ablation of Photovoltaic Cover Glass for Improved Contour Accuracy

Laser etched gratings inside microstructured optical fibres

Ablation of silicon suboxide thin layers

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