Laser-enhanced jet plating: A method of high-speed maskless patterning

Gutfeld, R. J. von; Gelchinski, M. H.; Romankiw, L. T.; Vigliotti, D. R.

doi:10.1063/1.94534

Cited by 52 publications

(12 citation statements)

References 6 publications

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“…Several groups have recognized the important role electrolyte impinging jets can play in localized electrodeposition [18][19][20]. Jet plating's promise as a maskless patterning technique has been recognized for several decades [21,24,25], though we report here the first integrated, software reconfigurable tool for flexibly printing micropatterns from a software drawing. We evaluate several plated materials (Cu, CuNi and Pt) to demonstrate flexibility in producing single-and multi-material patterns from both custom (Cu and CuNi) and commercial (Pt) plating baths.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical printing: software reconfigurable electrochemical microfabrication

Whitaker

Nelson

Schwartz

2005

J. Micromech. Microeng.

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Electrochemical printing (EcP) is a software reconfigurable tool and process for electrodeposition of multi-scale, multi-material objects from input drawings. The EcP system—comprising custom LabVIEW print driver software, hardware, electrolyte and a microjet print nozzle—creates complex patterns by locally electroplating individual metal and alloy dots as the microjet rasters over a substrate. The rastering of a microjet just a few microns above the substrate provides extraordinary convective mass transfer rates, allowing material growth rates that are routinely two orders of magnitude greater than in conventional plating. EcP has the flexibility to vary the print resolution and material composition during the patterning process via real time control of the microjet fly height, electrolyte flow rate and applied current. Microjet fly-height is used to vary the print resolution from 50 to 1000 dots per inch during the printing of a copper pattern. Simultaneous control of electrolyte flow rate and applied current through the microjet nozzle is used to achieve high plating efficiencies, well-formed dots and alloys of specific compositions for the copper and nickel–copper systems. It is also shown that commercially available noble metal plating baths can be used in the EcP tool, despite the unusually large current densities achievable and the complexity of commercial bath additives. Issues associated with making EcP a robust tool for 2D and 3D microfabrication are discussed.

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Section: Introductionmentioning

confidence: 99%

Electrochemical printing: software reconfigurable electrochemical microfabrication

Whitaker

Nelson

Schwartz

2005

J. Micromech. Microeng.

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“…Forced convection reduces the diffusion layer thickness, which in turn increases the limiting current . Concepts for boosting the deposition rates in conventional electroplating are stirring, ultrasonic fields, liquid jets, laser‐induced convection or a combinations of these methods . Liquid jets and laser‐induced convection were shown to be particularly effective.…”

Section: Discussionmentioning

confidence: 99%

Additive Manufacturing of Metal Structures at the Micrometer Scale

et al. 2017

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Currently, the focus of additive manufacturing (AM) is shifting from simple prototyping to actual production. One driving factor of this process is the ability of AM to build geometries that are not accessible by subtractive fabrication techniques. While these techniques often call for a geometry that is easiest to manufacture, AM enables the geometry required for best performance to be built by freeing the design process from restrictions imposed by traditional machining. At the micrometer scale, the design limitations of standard fabrication techniques are even more severe. Microscale AM thus holds great potential, as confirmed by the rapid success of commercial micro-stereolithography tools as an enabling technology for a broad range of scientific applications. For metals, however, there is still no established AM solution at small scales. To tackle the limited resolution of standard metal AM methods (a few tens of micrometers at best), various new techniques aimed at the micrometer scale and below are presently under development. Here, we review these recent efforts. Specifically, we feature the techniques of direct ink writing, electrohydrodynamic printing, laser-assisted electrophoretic deposition, laser-induced forward transfer, local electroplating methods, laser-induced photoreduction and focused electron or ion beam induced deposition. Although these methods have proven to facilitate the AM of metals with feature sizes in the range of 0.1-10 µm, they are still in a prototype stage and their potential is not fully explored yet. For instance, comprehensive studies of material availability and material properties are often lacking, yet compulsory for actual applications. We address these items while critically discussing and comparing the potential of current microscale metal AM techniques.

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“…Laser assisted deposition (LAD) methods, which is perhaps a more correct appellation for LDI used to drive chemical reactions, was first utilised by von Gutfeld [38] and co-workers to electrodeposit copper and gold micro-patterns [39][40][41]. In their early work [38] a laser was used to simply increase the rate of metal electro-reduction by raising the temperature very close to the electrode surface.…”

Section: Chemical Techniquesmentioning

confidence: 99%

Fabrication of micro- and nano-structured materials using mask-less processes

Roy¹

2007

J. Phys. D: Appl. Phys.

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Micro- and nano-scale devices are used in electronics, micro-electro- mechanical, bio-analytical and medical components. An essential step for the fabrication of such small scale devices is photolithography. Photolithography requires a master mask to transfer micrometre or sub-micrometre scale patterns onto a substrate. The requirement of a physical, rigid mask can impede progress in applications which require rapid prototyping, flexible substrates, multiple alignment and 3D fabrication. Alternative technologies, which do not require the use of a physical mask, are suitable for these applications. In this paper mask-less methods of micro- and nano-scale fabrication have been discussed. The most common technique, which is the laser direct imaging (LDI), technique has been applied to fabricate micrometre scale structures on printed circuit boards, glass and epoxy. LDI can be combined with chemical methods to deposit metals, inorganic materials as well as some organic entities at the micrometre scale. Inkjet technology can be used to fabricate micrometre patterns of etch resists, organic transistors as well as arrays for bioanalysis. Electrohydrodynamic atomisation is used to fabricate micrometre scale ceramic features. Electrochemical methodologies offer a variety of technical solutions for micro- and nano-fabrication owing to the fact that electron charge transfer can be constrained to a solid–liquid interface. Electrochemical printing is an adaptation of inkjet printing which can be used for rapid prototyping of metallic circuits. Micro-machining using nano-second voltage pulses have been used to fabricate high precision features on metals and semiconductors. Optimisation of reactor, electrochemistry and fluid flow (EnFACE) has also been employed to transfer micrometre scale patterns on a copper substrate. Nano-scale features have been fabricated by using specialised tools such as scanning tunnelling microscopy, atomic force microscopy and focused ion beam. The methodologies adopted for nano-fabrication have analogies with the micrometre scale patterning methods. Currently, the resolution of mask-less techniques is lower than that of lithographic methods using a physical mask. However, in future, hybridisation or combination of the mask-less methods could lead to high resolution and higher precision micro- and nano-scale patterning methods.

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Laser-enhanced jet plating: A method of high-speed maskless patterning

Cited by 52 publications

References 6 publications

Electrochemical printing: software reconfigurable electrochemical microfabrication

Electrochemical printing: software reconfigurable electrochemical microfabrication

Additive Manufacturing of Metal Structures at the Micrometer Scale

Fabrication of micro- and nano-structured materials using mask-less processes

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