2007
DOI: 10.1088/0022-3727/40/22/r02
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Fabrication of micro- and nano-structured materials using mask-less processes

Abstract: Micro- and nano-scale devices are used in electronics, micro-electro- mechanical, bio-analytical and medical components. An essential step for the fabrication of such small scale devices is photolithography. Photolithography requires a master mask to transfer micrometre or sub-micrometre scale patterns onto a substrate. The requirement of a physical, rigid mask can impede progress in applications which require rapid prototyping, flexible substrates, multiple alignment and 3D fabrication. Alternative technologi… Show more

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Cited by 87 publications
(64 citation statements)
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“…A number of methods have been reported for the fabrication of nanometric metallic gratings or periodic structures, generally based on a metallic lift-off process of an electron-beam patterned polymeric resist or fastreplication techniques [23]. Features smaller than 100 nm have been demonstrated [24].…”
Section: Grating Geometry and Duty Factor Effect With Mappedmentioning
confidence: 99%
“…A number of methods have been reported for the fabrication of nanometric metallic gratings or periodic structures, generally based on a metallic lift-off process of an electron-beam patterned polymeric resist or fastreplication techniques [23]. Features smaller than 100 nm have been demonstrated [24].…”
Section: Grating Geometry and Duty Factor Effect With Mappedmentioning
confidence: 99%
“…The development of alternative microfabrication technologies which allow batch processing but avoid or minimise repeated and direct patterning of the substrate is therefore of considerable interest [7,8,17]. The Electrochemical nano Fabrication using Chemistry and Engineering (EnFACE) technology is one such method, which has explored the possibility of performing selective deposition or etching on 4 a substrate [18][19][20][21].…”
Section: Introductionmentioning
confidence: 99%
“…The proposed technique does, however, require careful control of the reactor design, and a narrow inter-electrode gap of less than 500 µm [17][18][19][20]. The thin gap between the electrodes can limit mass transport and anodic or cathodic gas evolution resulting in bubble formation and retention has also been recognised as issue [20][21] which could limit its potential use.…”
Section: Introductionmentioning
confidence: 99%
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“…Tip based electrochemical machining has been widely used in the past to subtractively machine metallic or non-metallic structures for microdevices. 10,11 However, electrochemical deposition processes have not been used until more recently for additive formation of 3D metal [12][13][14][15] and conductive polymer [16][17][18] micro-structures. Metal electrodeposition typically involves the reduction of metal ions into metal atoms on a conductive substrate.…”
mentioning
confidence: 99%