Laser-direct process of Cu nano-ink to coat highly conductive and adhesive metallization patterns on plastic substrate

Min, Hyungsuk; Lee, Byoung-Yoon; Jeong, Sooncheol; Lee, Myeongkyu

doi:10.1016/j.optlaseng.2015.12.007

Cited by 24 publications

(8 citation statements)

References 24 publications

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“…Interestingly, for both thermally sintered thinner and thicker films, films sintered at 150 8C (1 = 1.70 10 À7 W m) were more conductive than those at higher temperatures, with the authors attributing this abnormal behaviour to the internal morphology and surface coverage of the annealed films. [89] Min et al synthesised a Cuf ink complexed with hexylamine and AMP which they sintered using a UV pulsed laser under N 2 after drying the ink at 70 8C for 10 min, resulting in a Cu film on PI with 1 = 1.74 10 À7 W m. [90] Farraj et al sintered a Cuf-AMP ink deposited on a PEN substrate via N 2 plasma and were able to obtain highly conductive Cu films (1 = 7.30 10 À8 W m) in 8 min (four times bulk Cu resistivity). [91] While Cuf-based MOD inks have garnered most of the interest in Cu MOD inks, the last decade has seen a few MOD inks synthesised using alternative Cu salts as starting reagents.…”

Section: Copper Mod Inksmentioning

confidence: 99%

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MODs vs. NPs: Vying for the Future of Printed Electronics

Douglas

Mrig

Knapp

2021

Chemistry A European J

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This Minireview compares two distinct ink types, namely metal-organic decomposition (MOD) and nanoparticle (NP) formulations, for use in the printing of some of the most conductive elements: silver, copper and aluminium. Printing of highly conductive features has found purpose across a broad array of electronics and as processing times and temperatures reduce, the avenues of application expand to low-cost flexible substrates, materials for wearable devices and beyond. Printing techniques such as screen, aerosol jet and inkjet printing are scalable, solutionbased processes that historically have employed NP formula-tions to achieve low resistivity coatings printed at high resolution. Since the turn of the century, the rise in MOD inks has vastly extended the range of potentially applicable compounds that can be printed, whilst simultaneously addressing shelf life and sintering issues. A brief introduction to the field and requirements of an ink will be presented followed by a detailed discussion of a wide array of synthetic routes to both MOD and NP inks. Unindustrialized materials will be discussed, with the challenges and outlook considered for the market leaders: silver and copper, in comparison with the emerging field of aluminium inks.

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Section: Copper Mod Inksmentioning

confidence: 99%

“…Min et al. synthesised a Cuf ink complexed with hexylamine and AMP which they sintered using a UV pulsed laser under N 2 after drying the ink at 70 °C for 10 min, resulting in a Cu film on PI with ρ= 1.74×10 −7 Ω m [90] . Farraj et al.…”

Section: Recent Developments In Metal Inksmentioning

confidence: 99%

MODs vs. NPs: Vying for the Future of Printed Electronics

Douglas

Mrig

Knapp

2021

Chemistry A European J

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“…The further development of this approach has led to significant expansion of the list of materials available for space-selective deposition, including Cu, Pd, Ni, Ag, Ru, Ir, and Pt [ 18 , 19 , 20 , 21 , 22 , 23 , 24 , 25 ]. The deposition process works on both semiconductor and dielectric substrates, which are widely used for photonic (including metamaterials), electronic, optoelectronic, and sensoric applications [ 26 , 27 , 28 ]. However, at the same time, one of the significant drawbacks of the LCLD is the low metallization rate compared to other techniques.…”

Section: Introductionmentioning

confidence: 99%

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

et al. 2022

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In this study, we developed a method for the fabrication of electrically conductive copper patterns of arbitrary topology and films on dielectric substrates, by improved laser-induced synthesis from deep eutectic solvents. A significant increase in the processing efficiency was achieved by acceptor substrate pretreatment, with the laser-induced microplasma technique, using auxiliary glass substrates and optional laser post-processing of the recorded structures; thus, the proposed approach offers a complete manufacturing cycle, utilizing a single, commercially available, pulsed Yb fiber laser system. The potential implications of the presented research are amplified by the observation of laser-induced periodic surface structures (LIPSSs) that may be useful for the further tuning of tracks’ functional properties.

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“…Also, a low temperature sintering is indispensable for organic electronic assemblies. To reduce the sintering temperature, several approaches have been proposed; these include decreasing the particle size, 12,13 the use of Cu-based metal-organic decomposition (MOD) inks, [14][15][16] laser processes, [17][18][19] and photonic sintering. [20][21][22] Concerning the particle size reduction approach, reduction of particle size may lead to easier oxidation in the case of copper, which results in problems with storage.…”

Section: Introductionmentioning

confidence: 99%

“…The lowest resistivity they could obtain was 1.74 Â 10 À5 O cm by using a nanosecond-pulsed ultraviolet laser of 355 nm wavelength and 4.2 W maximum output power. 18 We have also used laser sintering for copper fine particle paste to generate electrically conductive copper film under a hydrogen/argon atmosphere. The films sintered under air showed insulating behaviour towards Cu 2 O, but sintered under H 2 /Ar, the film with a high conductivity of 1.05 Â 10 À5 O cm was obtained.…”

Section: Introductionmentioning

confidence: 99%

Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

et al. 2017

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A method for producing Cu films with low resistivity, based on low temperature sintering, is demonstrated. The Cu inks for preparing conductive Cu films consisted of Cu particles that were coated with a decomposable polymer (poly(propylenecarbonate), PPC) as well as a self-reducible copper formate/1-amino-2- propanol (CuF-IPA) complex as an additive. The sintering temperature used in this study was as low as 100 degrees C. Following sintering at a temperature of 100 degrees C, the lowest reported resistivity (8.8 x 10(-7) Omega m) was achieved through the use of Cu-based metal-organic decomposition (MOD) inks. This was due to the dual promotional effects of the aminolysis of PPC with IPA and the pyrolysis of the CuF-IPA complex

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Laser-direct process of Cu nano-ink to coat highly conductive and adhesive metallization patterns on plastic substrate

Cited by 24 publications

References 24 publications

MODs vs. NPs: Vying for the Future of Printed Electronics

MODs vs. NPs: Vying for the Future of Printed Electronics

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

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