“…The further development of this approach has led to significant expansion of the list of materials available for space-selective deposition, including Cu, Pd, Ni, Ag, Ru, Ir, and Pt [ 18 , 19 , 20 , 21 , 22 , 23 , 24 , 25 ]. The deposition process works on both semiconductor and dielectric substrates, which are widely used for photonic (including metamaterials), electronic, optoelectronic, and sensoric applications [ 26 , 27 , 28 ]. However, at the same time, one of the significant drawbacks of the LCLD is the low metallization rate compared to other techniques.…”