2022
DOI: 10.1021/acsaelm.1c01193
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Laser Direct Activation of Polyimide for Selective Electroless Plating of Flexible Conductive Patterns

Abstract: Flexible conductive patterns on polyimide substrates are attracting increasing research interest in the areas of wearables, biomedicals, automotives, and energy harvesters. This paper reports a laser-induced selective activation (LISA) process for electroless metallization and, therefore, the creation of complex conductive patterns on polyimide substrates. In this process, a Q-switched pulsed laser is utilized for scanning the surface and forming the catalytic layer consisting of microporous structures, which … Show more

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Cited by 9 publications
(4 citation statements)
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“…Figure 1d shows the comparison of the processing time between previously reported laser fabrications [26,[65][66][67][68] and this work for the synthesis of porous graphene with dimensions of 10 × 10, 100 × 100, and 200 × 200 mm 2 . The difference in production time was negligible in the small area of 10 × 10 mm 2 , while a significant decrease of more than 66.5 times was confirmed in large areas of 100 × 100 and 200 × 200 mm 2 .…”
Section: Fpg Fabrication Mechanism By Synergistic Photo-effectsmentioning
confidence: 88%
“…Figure 1d shows the comparison of the processing time between previously reported laser fabrications [26,[65][66][67][68] and this work for the synthesis of porous graphene with dimensions of 10 × 10, 100 × 100, and 200 × 200 mm 2 . The difference in production time was negligible in the small area of 10 × 10 mm 2 , while a significant decrease of more than 66.5 times was confirmed in large areas of 100 × 100 and 200 × 200 mm 2 .…”
Section: Fpg Fabrication Mechanism By Synergistic Photo-effectsmentioning
confidence: 88%
“…Third, Anderetta et al reported that the PAA solution showed feasibility for epoxy resin, but there was the most peeled metal observation along the grid lines among these studies [19]. Lastly, Ren et al have suggested the KNaC 4 H 4 O 6 solution for electroless plating on PI due to its verified excellent adhesive strength of 5B [20].…”
Section: Adhesion Strength Between Pekk-ni Coatingmentioning
confidence: 99%
“…Researchers have proposed various novel methods to fabricate flexible circuits while reducing pollution and cost, including metal nano wires [29] and nanoparticle ink printing, [30,31] laser ablation, [32] and laser-seeded deposition. [33][34][35] We utilize the laser scribing method on the commercially available copperpolyimide film to achieve a cost-efficient and environmentfriendly fabrication for rapid and adaptive patterning of flexible devices.…”
Section: Introductionmentioning
confidence: 99%