1989
DOI: 10.1117/12.976391
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Laser Diode Cooling For High Average Power Applications

Abstract: Many applications for semiconductor lasers that require high average power are limited by the inability to remove the waste heat generated by the diode lasers. In order to reduce the cost and complexity of these applications a heat sink package has been developed which is based on water cooled silicon microstructures. Thermal resistivities of less than 0.025 °C /(W /cm2) have been measured which should be adequate for up to CW operation of diode laser arrays. This concept can easily be scaled to large areas an… Show more

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Cited by 6 publications
(2 citation statements)
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“…It has been observed after the works 33–35 and a review article 36 that more interest has been paid to diversify the applications of microchannels in other areas of heating and cooling applications. There are studies found in the open literature that extend research on both single‐phase and two‐phase fluid flow and heat transfer in microchannels.…”
Section: Literature Review Scope Of Further Study and Design Of mentioning
confidence: 99%
See 1 more Smart Citation
“…It has been observed after the works 33–35 and a review article 36 that more interest has been paid to diversify the applications of microchannels in other areas of heating and cooling applications. There are studies found in the open literature that extend research on both single‐phase and two‐phase fluid flow and heat transfer in microchannels.…”
Section: Literature Review Scope Of Further Study and Design Of mentioning
confidence: 99%
“…The concepts of electronics cooling have been further developed using MCHX 35. A comprehensive review of published works on MCHS for electronics cooling is available, including critical findings and the effectiveness of such devices 36.…”
Section: Introductionmentioning
confidence: 99%